Low Fluid Sensor; Secs/Gem Interface; Substrate Heaters - Nordson Asymtek Spectrum Series Installation, Operation & Maintenance Manual

1.8.3

Low Fluid Sensor

Low fluid sensing can be accomplished by installing capacitive or magnetic sensors on the fluid
reservoirs. In addition, low fluid sensing can be accomplished through the software, which features fluid
usage tracking. By inputting the fluid mass contained in the reservoir, the software can keep track of
material usage during dispensing. Both low and critically low values can be monitored. When a low fluid
condition is detected, the light beacon changes from green to blue. Additionally, the Fluidmove software
displays yellow (caution), and then red (critical) user warnings for low fluid conditions in the Run
Window.
1.8.4

SECS/GEM Interface

SECS/GEM is the protocol used for linking several factory equipment units together via a host computer.
The GEM standard defines useful conventions for designing the communications interface on a unit of
factory equipment to improve operations with a host computer.
1.8.5

Substrate Heaters

Dedicated, heated tooling is often required to enable proper fluid flow once dispensed on the substrate.
The S-920 provides for either contact or non-contact impingement heating. Heated tooling is custom
designed depending on the substrate and carrier type. Temperature values are stored in the program
recipe, and are automatically retrieved when loading the program. For additional information, refer to the
Fluidmove User Guide or Online Help.
1.8.5.1 Rapid Response Heater™ System
Asymtek's new Rapid Response Heaters with low-mass design rapidly ramp to temperature for uniform
material flow and quick cool-down for fast tool change out. An advanced hole pattern provides highly
uniform impingement heat across the entire part surface.
1.8.5.2 Controlled Process Heat (CpH™)
Asymtek's optional Controlled Process Heat (CpH) software increases functional control that eliminates
operator interaction altogether: software-managed heat levels (e.g., warm up, process ramp, cool down,
etc.) with programmable shut-off timers and 'step-down' or 'no-heat' capability when a part is not
present. CpH control improves both yield and 'thermal footprint' efficiency by requiring less power.
1-6 Introduction