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Status Indication
Insulation Method
Dielectric Strength
Insulation Resistance
External Power Supply
Derating Conditions
Internal Current Consumption
Maximum Heat Value
Hot Swapping
(Removal/insertion under power)
Approx. Mass
External Dimensions
2) The following diagram shows the circuit configuration.
To CPU
From CPU
Do not replace the built-in fuses of the Register I/O Modules.
CAUTION
If the built-in fuses are replaced by anyone other than a Yaskawa-approved
technician, a failure or malfunction may occur in the Register I/O Modules, and
the guarantee is void.
R: Lights while the Module is operating normally.
ACTIVE: Lights during input output processing.
F: Lights when the fuse is blown out or the output power supply
is disconnected.
Photocoupler
1,500 VAC for 1 min or 1,800 VAC for 1 s between the input out-
put terminals and the internal circuits.
100 MΩ min. at room temperature and humidity between the
input output terminals and the ground (measured with a 500
VDC test voltage megohmmeter).
12 VDC supplied to signals
None
150 mA max. at 5 VDC
3.5 W
Permitted
300 g
40.3×130×103.9 mm (W×H×D)
Photo-
coupler
3.3kΩ
Photo-
coupler
5-3
5.1 Register Input Specifications
Specifications
At 12 VDC
24 VDC supplied to signals
Connector CN1
Pin No.
INCOMM
A11
B11
DATA1
B20
DATA2
A20
DATA3
B19
DATA4
A19
+12/24V
A1
B1
SEL1
B10
0V
A2
Fuse
B2
At 24 VDC
Contact points
+
12/24VDC
-
5
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