Packaging/Power; Intel ® 6300Esb System Features; Firmware Hub (Fwh) - Intel 855GME Design Manual

Chipset, ich embedded platform
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®
Intel
855GME Chipset and Intel
2.3.6.4

Packaging/Power

732-pin Micro-FCBGA (37.5 mm x 37.5 mm)
VTTLF, VTTHF (1.05 V)
VCC, VCCASM, VCCHL, VCCAHPLL, VCCAGPLL, VCCADPLLA, VCCADPLLB
(1.2 V or 1.35 V; as needed to support 250MHz graphics core frequency and DDR333)
VCCADAC, VCCDVO, VCCDLVDS, VCCALVDS, (1.5 V)
VCCSM, VCCQSM, VCCTXLVDS (2.5 V)
VCCGPIO (3.3 V)
Power Management (855GME)
— Optimized Clock Gating for 3D and Display Engines
— On-die thermal sensor
®
2.3.7
Intel
®
The Intel
The I/O Controller Hub (Intel
subsystem with access to the rest of the system. Additionally, it integrates many I/O functions.
®
The Intel
Upstream Hub Interface for access to the MCH
Two port Serial ATA controller
Two channel Ultra ATA/100 Bus Master IDE controller
One EHCI USB 2.0 host controller and two UHCI USB 1.1 host controllers (expanded
capabilities for four ports)
I/O APIC
SMBus 2.0 controller
FWH interface
LPC interface
AC'97 2.2 interface
PCI-X 1.0 interface at 66MHz
PCI 2.2 interface
Two Serial I/O ports
Two-Stage Watchdog timer
2.3.8

Firmware Hub (FWH)

An integrated hardware Random Number Generator (RNG) on Intel parts
Register-based locking
6300ESB System Features
6300ESB I/O Controller Hub system consists of:
®
6300ESB I/O Controller Hub integrates:
January 2007
®
6300ESB ICH Embedded Platform Design Guide
6300ESB I/O Controller Hub) which provides the I/O
System Overview
31

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