Intel 855GME Design Manual page 266

®
Intel 855GME Chipset and Intel
Schematic Checklist Summary
Table 115. Connection Recommendations (Sheet 2 of 3)
Pin Name
IERR#
INIT#
IGNNE#
LINT0
LINT1
PROCHOT#
PSI#
PWRGOOD
RESET#
SLP#
SMI#
STPCLK#
266
®
6300ESB ICH Embedded Platform Design Guide
System Series
Pull-up/Pull-down Termination
56 Ω pull-up to
VCCP
56 Ω pull up to
VCCP
330 Ω pull-up to
VCCP
220 Ω ± 5% 22.6 Ω ± 1%
pull-up to VCCP from pull-up
WHEN USING to
ITP700FLEX ITP700FLEX
Voltage
Translation
IERR# is a 1.05 V signal.
Voltage translation logic and/or
series resistor may be required if
used.
Point-to-point connection to the
6300ESB (INIT# signal). Voltage
R1 = 1.3 K Ω
translation circuit is required if
R2 = 330 Ω
connecting to FWH. Signal is T-
Rs = 330 Ω
split from the 6300ESB to FWH.
Refer to Figure
Point-to-point connection to the
6300ESB (IGNNE# signal).
Point-to-point connection to the
6300ESB (INTR signal).
Point-to-point connection to the
6300ESB (NMI signal).
PROCHOT# is a VCCP signal.
Voltage translation logic may be
required if used.
R1 = 1.3 K Ω
When Voltage Translation is
R2 = 330 Ω
Required: Driver isolation
resistor (Rs) shall be placed at
Rs = 330 Ω
the beginning of the T-split to the
system receiver.
Refer to Figure
May be left as NC, if not used for
IMVP.
Point-to-point connection to an
output of an AND gate (AND of
PWRGD_3V and
CPU_VR_PWRGD) with resistor
placed by the processor.
When ITP700FLEX is Not
Used: Point-to-point connection
to GMCH (CPURST# signal).
When ITP700FLEX is Used:
RESET# connects from
processor to GMCH (CPURST#
signal) and then forks out to
ITP700 FLEX, with pull-up and
series damping resistor placed
next to ITP.
Point-to-point connection to the
6300ESB (CPUSLP# signal).
Point-to-point connection to the
6300ESB (SMI# signal).
Point-to-point connection to the
6300ESB (STPCLK# signal).
√
Notes
148.
149.