Oracle Exadata X10M Service Manual page 121

Attach an antistatic wrist strap to your wrist, and then to a metal area of the
e.
chassis.
See Take Antistatic
Remove the server top cover.
f.
Use a Torx T15 screwdriver to unlock.
See Remove the Server Top
Remove the following reusable components:
2.
• Air baffle
Remove the air baffle (sitting over the two processors) by lifting the baffle up
and out of the server. Lift up the air baffle in the rear at a 50 degree angle, and
slide slightly rearward to clear the air baffle tabs that prevent the front of the
baffle from lifting up. Set aside the air baffle.
See Remove the Air
• Fan modules
See Remove a Fan
• Fan tray
See Remove the Fan
• PCIe cards
See Remove a Half Height PCIe
See Remove a Full Height PCIe
• SAS storage drive cables (if present)
See Remove SAS Storage Drive
• Power supplies
See Remove a Power
Caution:
During the motherboard removal procedure, it is important to label
power supplies with the slot numbers from which they were removed
(PS0, PS1). This is required because the power supplies must be
reinstalled into the slots from which they were removed; otherwise,
the server key identity properties (KIP) data might be lost. When a
server requires service, the KIP is used by Oracle to verify that the
warranty on the server has not expired. For more information on KIP,
see FRU Key Identity Properties (KIP) Automated
Disconnect the following cables from the motherboard:
3.
Note:
Label any unlabeled cables to ease reconnecting them after the
replacement motherboard is installed.
Measures.
Cover.
Baffle.
Module.
Tray.
Card.
Card.
Cables.
Supply.
Chapter 12
Remove the Motherboard Assembly
Update.
12-2