NEC 78K0 User Manual page 595

Table 34-1. Surface Mounting Type Soldering Conditions (3/3)
(3) 80-pin plastic TQFP (fine pitch) (12 × 12)
µ
PD78F0148M1GK-9EU, 78F0148M2GK-9EU, 78F0148M3GK-9EU, 78F0148M4GK-9EU, 78F0148M5GK-9EU,
µ
PD 78F0148M6GK-9EU, 78F0148M1GK(A)-9EU, 78F0148M2GK(A)-9EU, 78F0148M3GK(A)-9EU,
µ
PD 78F0148M4GK(A)-9EU, 78F0148M5GK(A)-9EU, 78F0148M6GK(A)-9EU, 78F0148M1GK(A1)-9EU,
µ
PD
78F0148M2GK(A1)-9EU, 78F0148M5GK(A1)-9EU, 78F0148M6GK(A1)-9EU
Soldering Method
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Infrared reflow
Count: 2 times or less, Exposure limit: 3 days
10 hours)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
VPS
Count: 2 times or less, Exposure limit: 3 days
10 hours)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Partial heating
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
CHAPTER 34 RECOMMENDED SOLDERING CONDITIONS
Soldering Conditions
*
User's Manual U15947EJ2V0UD
Note
(after that, prebake at 125°C for
Note
(after that, prebake at 125°C for
Recommended
Condition Symbol
IR35-103-2
VP15-103-2
−
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