NEC 78K0 User Manual page 594

Table 34-1. Surface Mounting Type Soldering Conditions (2/3)
(2) 80-pin plastic TQFP (fine pitch) (12 × 12)
µ
PD780143GK-×××-9EU, 780144GK-×××-9EU, 780146GK-×××-9EU, 780148GK-×××-9EU, 780143GK(A)-×××-9EU,
µ
PD 780144GK(A)-×××-9EU, 780146GK(A)-×××-9EU, 780148GK(A)-×××-9EU, 780143GK(A1)-×××-9EU,
µ
PD 780144GK(A1)-×××-9EU, 780146GK(A1)-×××-9EU, 780148GK(A1)-×××-9EU, 780143GK(A2)-×××-9EU,
µ
PD
780144GK(A2)-×××-9EU, 780146GK(A2)-×××-9EU, 780148GK(A2)-×××-9EU
Soldering Method
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Infrared reflow
Count: 2 times or less, Exposure limit: 7 days
10 hours)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
VPS
Count: 2 times or less, Exposure limit: 7 days
10 hours)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Partial heating
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
594
CHAPTER 34 RECOMMENDED SOLDERING CONDITIONS
Soldering Conditions
User's Manual U15947EJ2V0UD
Note
(after that, prebake at 125°C for
Note
(after that, prebake at 125°C for
*
Recommended
Condition Symbol
IR35-107-2
VP15-107-2
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