Package Dimensions; Wlcsp Package Dimensions - Cirrus Logic CS42L42 Manual

10 Package Dimensions

10.1 WLCSP Package Dimensions

WAFER BACK SIDE
Notes:
• Dimensioning and tolerances per ASME Y 14.5M–1994.
• The Ball A1 position indicator is for illustration purposes only and may not be to scale.
• Dimension "b" applies to the solder sphere diameter and is measured at the maximum solder-ball diameter, parallel to primary Datum Z.
DS1083F2
X X
Ball A 1 Location
Indicator
Y
Y
Seating Plane
Table 10-1. WLCSP Package Dimensions
Dimension
Minimum
A 0.443
A1 0.148
A2 0.284
M BSC
N BSC
b 0.225
c REF
d REF
e BSC
X 2.614
Y 2.614
ccc = 0.015
ddd = 0.015
Note: Controlling dimension is millimeters.
A
A 2
A1
b
e
Øb
Z
Øddd
Øccc
SIDE VIEW
Millimeters
Nominal
0.474
0.174
0.300
2.100
2.100
0.250
0.272
0.272
0.350
2.644
2.644
10 Package Dimensions
Ball A1 Location Indicator (seen through package)
M
b
e d
Z X Y
Z
BUMP SIDE
Maximum
0.505
0.200
0.316
BSC
BSC
0.300
REF
REF
BSC
2.674
2.674
CS42L42
N
c
179