Agp_Busy# Design Requirement; Smbus) System Management Interface - Intel 855GM Design Manual

Chipset platform
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R
16.7.3.

AGP_BUSY# Design Requirement

Signal
AGPBUSY#
NOTE: Please also consult Intel for the latest AGP Busy and Stop signal
16.7.4.

(SMBus) System Management Interface

Pin Name
SM_INTRUDER#
100 k Ω pull-up to
VccRTC
10 k Ω pull-up to
SMB_ALERT#/
GPIO[11]
V3ALWAYS
SMBCLK,
Pull-up to V3ALWAYS
SMBDATA,
SMLINK[1:0]
®
Intel
855GM/855GME Chipset Platform Design Guide
System
Pull-up/Pull-down
10 K Ω pull-up to
This ICH4-M signal requires a pull-up to the switched 3.3-V rail
(powered OFF during S3).
Vcc3_3
This ICH4-M signal must be connected to the AGP_BUSY#
output of GMCH.
System
Pull-up/Pull-down
RTC well input requires pull-up (10 k-100 k) to reduce leakage
from coin cell battery in G3.
Require external pull-up resistors. Pull up value is determined by
bus characteristics. CRB schematics use 10 k Ω pull-up resistors.
The SMBus and SMLink signals must be connected together
externally in S0 for SMBus 2.0 compliance: SMBCLK connected
to SMLink[0] and SMBDATA connected to SMLink[1].
Platform Design Checklist
Notes
implementation.
Notes
303

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