Pad Configuration Diagram (Chip) - Epson S1C17F13 Technical Manual

1.3.2

Pad Configuration Diagram (Chip)

Port function or Pad
signal assignment name
P14/SENB1/PIOD0 P14
P15/SENA1/PIOD1 P15
P16/REF1/PIOD2 P16
P17/RFIN1/PIOD3 P17
V V
SS SS
V V
SS SS
– N.C.
P20/SDO1/PIOD4 P20
P21/SDI1/PIOD5 P21
P22/SPICLK1/PIOD6 P22
P23/#SPISS1/PIOD7 P23
V V
DD DD
P24/#SPISS2 P24
P25/SPICLK2 P25
P26/SDI2 P26
P27/SDO2 P27
– N.C.
P30/EXCL1/RFCLKO0 P30
– N.C.
V V
SS SS
V V
SS SS
Pad opening No. 1–21, 39–57: X = 76 µm, Y = 90 µm
No. 22–29:
No. 30–38, 58–78: X = 90 µm, Y = 76 µm
Chip thickness 400 µm
S1C17F13 TeChniCal Manual
(Rev. 1.0)
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Figure 1. 3.2.1 S1C17F13 Pad Configuration Diagram (Chip)
X = 85 µm, Y = 122 µm
Seiko epson Corporation
Y
X
(0, 0)
Die No. CJF13Dxxx
3.339 mm
1 OVERVIEW
38 V V
SS SS
37 V V
D1 D1
36 N.C. –
35 P07 P07/SDO0/PIOA3
34 P06 P06/SDI0/PIOA2
33 P05 P05/SPICLK0/PIOA1
32 P04 P04/#SPISS0/PIOA0
31 P03 P03/EXOSC/#PIOCE
30 P02 P02/EXCL0/#PIORD
29 V V
PP PP
28 C C
2P 2P
27 C C
2N 2N
26 C C
1H 1H
25 C C
1P 1P
24 C C
1N 1N
23 V V
DD DD
22 V V
SS SS
1-5