Pad Configuration Diagram (Chip) - Epson S1C17W03 Technical Manual

1 OVERVIEW

1.3.2 Pad Configuration Diagram (Chip)

Port function
or signal Pad
assignment name
P14/RFIN0/UPMUX P14
P15/REF0/UPMUX P15
P16/SENA0/UPMUX P16
P17/SENB0/UPMUX P17
P40/SENB1 P40
P41/SENA1 P41
P42/REF1 P42
P43/RFIN1 P43
V V
PP PP
P00/REMO/UPMUX P00
P01/CLPLS/UPMUX P01
P02/RFCLKO1/UPMUX P02
Figure 1.3.2.1 S1C17W03/W04 Pad Configuration Diagram (Chip)
Pad opening: X = 68 µm, Y = 68 µm
Chip thickness: 400 µm
No. X µm Y µm
1 -52.3 -971.5
2 27.7 -971.5
3 107.7 -971.5
4 187.7 -971.5
5 267.7 -971.5
6 347.7 -971.5
7 427.7 -971.5
8 512.7 -971.5
9 592.7 -971.5
10 672.7 -971.5
11 752.7 -971.5
12 832.7 -971.5
1-6
37
38
39
40
Y
(0, 0)
41
42
43
44
45
46
47
48
2.325 mm
Table 1.3.2.1 S1C17W03/W04 Pad Coordinates
No. X µm Y µm
13 1,083.0 -721.2
14 1,083.0 -641.2
15 1,083.0 -561.2
16 1,083.0 -481.2
17 1,083.0 -401.2
18 1,083.0 -321.2
19 1,083.0 239.6
20 1,083.0 339.6
21 1,083.0 465.6
22 1,083.0 545.6
23 1,083.0 625.6
24 1,083.0 705.6
Seiko Epson Corporation
V
24
D2
V
23
DD
V
22
SS
#RESET
21
OSC1
20
OSC2
19
X
V
18
DDA
VREFA0
17
P35
16
P34
15
14 P33
Die No. CJxxxxxxx
13 P32
No. X µm Y µm
25 891.5 971.5
26 811.5 971.5
27 731.5 971.5
28 632.3 971.5
29 552.3 971.5
30 472.3 971.5
31 110.8 971.5
32 30.8 971.5
33 -49.2 971.5
34 -129.2 971.5
35 -209.2 971.5
36 -289.2 971.5
S1C17W03/W04 TECHNICAL MANUAL
V
D2
V
DD
V
SS
#RESET
OSC1
OSC2
V
DDA
VREFA0
P35/UPMUX/ADIN00
P34/UPMUX/ADIN01
P33/UPMUX/ADIN02
P32/UPMUX/ADIN03
No. X µm Y µm
37 -1,083.0 852.0
38 -1,083.0 772.0
39 -1,083.0 692.0
40 -1,083.0 612.0
41 -1,083.0 -292.0
42 -1,083.0 -372.0
43 -1,083.0 -452.0
44 -1,083.0 -532.0
45 -1,083.0 -612.0
46 -1,083.0 -692.0
47 -1,083.0 -772.0
48 -1,083.0 -852.0
(Rev. 1.2)