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23
Basic External Connection Diagram
+
+
2.0–3.6 V
C
C
PW1-1
∗2
∗1
C1P
C1N
C1H
OPEN
C2P
C2N
V
PP
C
C
C
C
R
TMP2
R
TMP1
R
REF
C
REF
∗1 When the Flash voltage booster is used
∗2 When the Flash voltage booster is not used
Sample external parts
Symbol
C
Bypass capacitor between V
PW1-1
C
Capacitor between V
PW1-2
C
Capacitor between V
PW1-3
C
V
stabilization capacitor
PW2
D1
C
V
stabilization capacitor
PW3
OSC
C
–
Flash power supply voltage boosting capacitors Ceramic capacitor
PW4
6
C
V
stabilization capacitor
PW7
PP
R
DSIO pull-up resistor
DBG
R
RFC reference resistor
REF
R
,
Resistive sensors
TMP1
2
C
RFC oscillating capacitor
REF
* For recommended component values, refer to "Recommended Operating Conditions" in the "Electrical Characteristics" chapter.
The C
, C
, C
, and C
G1
D1
G3
D3
mounted on the printed circuit board actually used.
S1C17F13 TeChniCal Manual
(Rev. 1.0)
Active matrix EPD panel
V
DD
V
DD (Pin 18)
C
PW1-2
PW1-3
C
PW2
V
D1
C
PW3
V
OSC
C
PW4
C1P
C1N
C
PW5
C1H
C
PW6
C2P
C2N
C
PW7
V
PP
OSC1
G1
OSC2
X'tal1
[The potential of the substrate
D1
OSC3
G3
OSC4
X'tal3/
D3
CR3
#RESET
TEST
V
SS
SENB1
SENA1
REF1
RFIN1
VM1
OPEN
VM2
IREF_M
Name
–V
Electrolytic capacitor
DD
SS
–V
Electrolytic capacitor (Place as closer to V
DD
SS
–V
Ceramic capacitor (Place as closer to V
DD
SS
Ceramic capacitor
Ceramic capacitor
Ceramic capacitor
Thick film chip resistor
Thick film chip resistor
Temperature sensor 103AP-2 manufactured by SEMITEC Corporation
Humidity sensor C15-M53R manufactured by SHINYEI Technology Co.,Ltd.
(* In AC oscillation mode for resistive sensor measurements)
Ceramic capacitor
capacitance values should be determined after performing matching evaluation of the resonator
Seiko epson Corporation
23 BASIC EXTERNAL CONNECTION DIAGRAM
S1C17F13
(back of the chip) is V
.]
SS
Recommended parts
Pxx
I/O
R
DBG
V
(
)
DD
DCLK
ICDmini
DSIO
DST2
(pin 18) as possible.)
DD
(pin 18) as possible.)
DD
23-1
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