Chapter 9 Pad Layout; Diagram Of Pad Layout - Epson S1C6S3N2 Technical Manual

CHAPTER 9
S1C6S3N2 TECHNICAL HARDWARE
PAD LAYOUT

Diagram of Pad Layout

9.1
15
20
25
30
35
45
40
10
Y
X
(0,0)
50
3.29 mm
EPSON
CHAPTER 9: PAD LAYOUT
5 1
79
75
70
65
60
55
Die No.
Chip thickness: 400 µm
Pad opening: 95 µm
I-127