Panel Prep A Ra Tion - Maple Systems Silver Plus Series Installation And Operation Manual

In stal la tion of OITs
Shielded Power Cable,
Maple P/N 6030-0009
HMI Power Supply
DC Output +V (+24V)
DC Output -V (Gnd)
+24V 0V FG

Panel Prep a ra tion

A metal panel or mounting surface with a minimum thickness of 15 gauge (0.059 inch/3.3mm) if cold-rolled steel or
hardened steel, or 10 gauge (0.101 inch/2.6mm) if aluminum alloy (6061-T6 preferred) is required. Thinner panels
or surfaces may bow between the mounting clamps and not form a seal with the gasket.
The area of the panel or mounting surface where the gasket comes into contact must be flat and free of scratches,
pits, and other features that prevent the gasket from sealing properly. If the panel or mounting surface is not
uniform, thick, flat, stiff, or smooth enough, then a sealant such as silicone may be required.
The power connector on the Silver Plus Series is a terminal block with wire clamps.
Lugs are not required.
HMI5056/HMI5070 Power Wiring
Output
FG
Control
Panel
Power
Connector
HMI5080/HMI5104/HMI5121/HMI5150 Power Wiring
WARNING: The OIT requires a stiff, flat, smooth mounting surface free of blemishes
to seal properly to NEMA 4.
13
1010-1007, Rev 05