NTRB21 TMDI card.......................................................................................................................... 656
Architecture............................................................................................................................................... 656
Signaling interface............................................................................................................................ 656
Interconnection................................................................................................................................. 656
Microprocessor................................................................................................................................. 657
Digital pad........................................................................................................................................ 657
D-channel interface.......................................................................................................................... 658
DS-1 Carrier interface...................................................................................................................... 659
Contents.................................................................................................................................................... 663
Physical description.................................................................................................................................. 663
Hardware architecture............................................................................................................................... 664
Faceplate connectors and indicators................................................................................................ 664
Functional description............................................................................................................................... 667
Contents.................................................................................................................................................... 669
Physical description.................................................................................................................................. 669
Functional description............................................................................................................................... 669
MGU dip switch settings............................................................................................................................ 671
Rear components............................................................................................................................. 674
Contents.................................................................................................................................................... 677
Introduction............................................................................................................................................... 677
Physical description.................................................................................................................................. 678
Functional description............................................................................................................................... 679
Connector pin assignments....................................................................................................................... 680
Configuring the QSDI card........................................................................................................................ 682
Address switch settings.................................................................................................................... 683
Baud rate switch settings................................................................................................................. 683
Test switch setting............................................................................................................................ 685
Software service changes................................................................................................................ 685
Applications............................................................................................................................................... 686
Index.....................................................................................................................................
Circuit Card Reference
663
669
677
689
July 2011
19