Hub Interface 2.0 Decoupling Guidelines; Unused Hub Interface 2.0 Interfaces; Hub Interface 1.5 Implementation; Hub Interface 1.5 High-Speed Routing Guidelines - Intel Xeon Design Manual

Processor with 512 kb l2 cache and intel e7500 chipset platform
Hide thumbs Also See for Xeon:
Table of Contents

Advertisement

7.2.4

Hub Interface 2.0 Decoupling Guidelines

To improve I/O power delivery, use two 0.1 µF capacitors per component (i.e., MCH, P64H2).
These capacitors should be placed within 150 mils of each package, adjacent to the rows that
contain the hub interface. If the layout allows, wide metal fingers running on the VSS side of the
board should connect the VCC1.8/VCC1.2 side of the capacitors to the VCC1.8/VCC1.2 power
pins. Similarly, if layout allows, metal fingers running on the VCC1.8/VCC1.2 side of the board
should connect the ground side of the capacitors to the VSS power pins.
7.2.5

Unused Hub Interface 2.0 Interfaces

Terminate unused Hub Interface 2.0 interfaces as described below:
All hub interface data and strobe signals can be left as no connects.
HIVREF and HISWNG must remain connected to the reference voltage divider circuits (refer
to
Figure
7.3

Hub Interface 1.5 Implementation

The Hub Interface 1.5 signals HI[7:0] are associated with HI_STBS/HI_STBF. For those familiar
with the Hub Interface 1.0 mode, HI_STBF and HI_STBS are called HI_STB# and HI_STB,
respectively.
Figure 7-7. 8-Bit Hub Interface 1.5 Routing
This section documents the routing guidelines for the Hub Interface 1.5 that is responsible for
connecting the MCH to the ICH3-S. Hub Interface 1.5 supports parallel termination mode only,
therefore the DPRSLPVR pin on the ICH3-S must be left as No Connect (NC); this signal has an
internal pull-down.
7.3.1

Hub Interface 1.5 High-Speed Routing Guidelines

The MCH and ICH3-S ball assignments are optimized to simplify the hub interface routing
between these devices. Route the hub interface signals directly from the MCH to ICH3-S with all
signals referenced to ground. Keep layer transitions to a minimum. If a layer change is required,
use only two vias per net, and keep all data signals and associated strobe signals on the same layer.
The Hub Interface 1.5 signal groups are listed in
Hub Interface 1.5 signals are given in
Design Guide
7-5). RCOMP must be pulled up to 1.2 V.
®
Intel
ICH3-S
CLK66
Table
HI_STBF
HI_STBS
HI[11:0]
MCH
CLK66
CLK
Synthesizer
Table
7-6. The general routing guidelines for the
7-7.
Hub Interface
89

Advertisement

Table of Contents
loading

Table of Contents