Toshiba TX03 Series Manual page 21

25.3 DC Electrical Characteristics (2/3).....................................................................................499
25.4 DC Electrical Characteristics (3/3).....................................................................................500
25.5 12/10-bit AD Converter Electrical Characteristics.............................................................501
25.6 AC Electrical Characteristics..............................................................................................502
25.6.1 AC Measurement Condition..........................................................................................................................................502
25.6.2 Serial Channel (SIO/UART).........................................................................................................................................502
25.6.2.1 I/O Interface Mode
25.6.3 Serial Bus Interface (I2C/SIO)......................................................................................................................................504
25.6.3.1 I2C Mode
25.6.3.2 Clock-Synchronous 8-bit SIO mode
25.6.4 Synchronous Serial Interface (SSP)..............................................................................................................................507
25.6.4.1 AC Measurement Condition
25.6.4.2 SSP SPI mode (Master)
25.6.4.3 SSP SPI mode (Slave)
25.6.5 Event Counter................................................................................................................................................................511
25.6.6 Capture...........................................................................................................................................................................511
25.6.7 External Interrupt...........................................................................................................................................................511
25.6.8 SCOUT pin AC Characteristics....................................................................................................................................512
25.6.9 Debug Communication..................................................................................................................................................513
25.6.9.1 SWD Interface
25.6.9.2 JTAG Interface
25.6.10 ETM Trace...................................................................................................................................................................514
25.6.11 On-chip Oscillator Characteristic................................................................................................................................514
25.6.12 Flash Characteristic.....................................................................................................................................................514
25.7 Recommended Oscillation Circuit......................................................................................515
25.7.1 Ceramic Oscillator.........................................................................................................................................................515
25.7.2 Crystal Oscillator...........................................................................................................................................................515
26. Package Dimensions
26.1 TMPM3V6FWFG...............................................................................................................517
26.2 TMPM3V6FWDFG.............................................................................................................518
26.3 TMPM3V4FWUG/TMPM3V4FSUG.................................................................................519
26.4 TMPM3V4FWEFG/TMPM3V4FSEFG.............................................................................520
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