Board Impedance/Stackup Summary; Mil Stackup (Not Routable); Mil Stackup - Intel VC820 - Desktop Board Motherboard Design Manual

5.3.9

Board Impedance/Stackup Summary

1. 7628 Cloth, 1 ply 0.007" when cured with 40% resin is the most popular and highest volume
PCB in production today. This stackup will make routing impossible.
•
•
Figure 5-3. 7 mil Stackup (Not Routable)
2. 2116 Cloth, 1 ply 0.0045" when cured with 53% resin is the second largest volume in
production today. Due to the impedance & layout requirement of traces for Direct RDRAM,
AGP 2.0, and hub interface, this stackup is recommended for Intel
design.
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Fab Construction (4 Layers)
•
Z
Figure 5-4. 4.5 mil Stackup
®
Intel 820 Chipset Design Guide
Fab Construction (4 Layers)
= 70 Ω ± 15%
Z
o
Component Side Layer: 1/2 oz Cu
Ground Layer 2: 1 oz Cu
Not Routable
Ground Layer 3: 1 oz Cu
Solder Side Layer 4: 1/2 oz Cu
= 60 ohms ± 10%
o
Component Side Layer: 1/2 oz Cu
Ground Layer 2: 1 oz Cu
Ground Layer 3: 1 oz Cu
Solder Side Layer 4: 1/2 oz Cu
7 Mil Prepreg
7 Mil Prepreg
4.5 Mil Prepreg
~48 Mil Core
4.5 Mil Prepreg
System Manufacturing
Total Thickness = 62 mils
®
820 chipset platform
Total Thickness = 62 mils
4 5 il t k d
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