Additional Design Considerations; Retention Mechanism Placement And Keepouts - Intel Pentium 4 Design Manual

In the 478-pin package / intel 850 chipset family platform
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R
10

Additional Design Considerations

This section documents system design considerations not addressed in previous sections.
10.1.1

Retention Mechanism Placement and Keepouts

The RM requires a keepout zone for a limited component height area under the RM. Figure 137
and Figure 138 show the relationship between the RM mounting holes and pin one of the socket.
In addition they also document the keepouts. A 0.409 inch diameter routing keepout should be
maintained on the secondary side of the board.
The retention holes should be a non-plated hole. Figure 139 illustrates the hole locations and
keepouts for the Intel 850 chipset heatsink retention mechanism. For heatsink volumetric
information refer to the Intel
Guidelines.
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®
Intel
Pentium
4 Processor / Intel
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Pentium
4 Processor in the 478-pin Package Thermal Design
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850 Chipset Family Platform Design Guide
Additional Design Considerations
191

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