Intel Pentium 4 Design Manual page 7

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9.9.4
9.9.5
9.9.6
9.10 Intel
9.11 FWH Guidelines ................................................................................................. 185
9.11.1
9.11.2
9.11.3
9.12 Intel
9.13 Glue Chip 4 (Intel
9.14 SPKR Pin Consideration..................................................................................... 187
9.15 1.8 V and 3.3 V Power Sequence Requirement................................................. 188
9.16 PIRQ Routing...................................................................................................... 189
10 Additional Design Considerations ................................................................................... 191
10.1.1
10.1.2
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11 Intel Pentium
Guidelines ....................................................................................................................... 197
11.1 Power Requirements .......................................................................................... 197
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
11.1.8
11.1.9
11.2 Thermal Considerations ..................................................................................... 220
11.2.1
11.2.2
11.2.3
11.3 Simulation ........................................................................................................... 223
11.3.1
11.3.2
11.4 Filter Specifications For VCCA, VCCIOPLL, and VSSA..................................... 225
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Intel Pentium 4 Processor / Intel
9.9.3.5.2
9.9.3.5.3
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Intel 82562ET / 82562EM Guidelines................................................ 175
9.9.4.1 Guidelines for Intel
Placement.......................................................................... 175
9.9.4.2 Crystals and Oscillators ..................................................... 176
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9.9.4.3 Intel 82562ET / 82562EM Termination Resistors ............ 176
9.9.4.4 Critical Dimensions ............................................................ 176
9.9.4.4.1
9.9.4.4.2
9.9.4.5 Reducing Circuit Inductance.............................................. 178
9.9.4.6 Terminating Unused Connections ..................................... 178
9.9.4.6.1
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Intel 82562 ET/EM Disable Guidelines.............................................. 180
82562ET / 82562EH Dual Footprint Guidelines .................................. 181
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ICH2 Routing Guidelines - Four-Layer Motherboard................................ 183
FWH Decoupling................................................................................. 185
In Circuit FWH Programming.............................................................. 185
FWH Vpp Design Guidelines .............................................................. 185
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ICH2 Decoupling Recommendations........................................................ 186
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ICH2 Glue Chip)................................................................... 186
Retention Mechanism Placement and Keepouts ................................ 191
Power Header for Active Cooling Solutions ........................................ 195
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4 Processor in the 478-Pin Package Processor Power Distribution
FMB1 VR Component Placement....................................................... 198
FMB2 VR Component Placement....................................................... 199
FMB1 Decoupling Requirements ........................................................ 200
FMB2 Decoupling Requirements ........................................................ 202
FMB1 Layout (6-Layer Board)............................................................. 205
FMB2 Four-Phase Layout (4-Layer Board) ........................................ 212
FMB2 - Three-Phase Layout (4-Layer Board).................................... 214
FMB1 - Common Layout Issues......................................................... 217
FMB2 - Common Layout Issues ......................................................... 219
FMB1................................................................................................... 220
FMB2................................................................................................... 220
FMB2 - Voltage Regulator Thermal Protection Circuit........................ 221
FMB1................................................................................................... 223
FMB2................................................................................................... 224
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850 Chipset Family Platform Design Guide
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Distance from Intel 82562EH to Magnetics
Module ............................................................... 174
Distance from LPF to Phone RJ11 .................... 175
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82562ET / 82562EM Component
Distance from Magnetics Module to RJ45......... 177
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Distance from Intel 82562ET to Magnetics
Module ............................................................... 178
Termination Plane Capacitance ........................ 179
Introduction
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