Thermal Considerations; Fmb1; Fmb2; Figure 164. Routing Of Vr Feedback Signal - Intel Pentium 4 Design Manual

Intel® Pentium® 4 Processor in the 478-Pin Package Processor Power Distribution Guidelines

Figure 164. Routing of VR Feedback Signal

11.2

Thermal Considerations

11.2.1

FMB1

For a power delivery solution to meet the flexible motherboard (FMB) requirements, it must be
able to delivery a fairly high amount of current. This high amount of current also requires that the
solution is able to dissipate the associated heat generated by the components and keep all of the
components and the PCB within their thermal specifications. OEMs should evaluate their
component configurations, system airflow and layout to ensure adequate thermal performance of
the processor power delivery solution.
11.2.2

FMB2

For a power delivery solution to meet the flexible motherboard (FMB2) requirements, it must be
able to delivery a high amount of current. This high amount of current also requires that the
solution is able to dissipate the associated heat generated by the components and keep all of the
components and the PCB within their thermal specifications. OEMs should evaluate their
component configurations, system airflow and layout to ensure adequate thermal performance of
the processor power delivery solution.
The table below shows the required amount of airflow needed for the documented designs to meet
FMB2 specifications and component thermal requirements.
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Intel Pentium 4 Processor / Intel
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850 Chipset Family Platform Design Guide
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