Platform Placement and Stack-Up Overview
3.2
Motherboard Layer Stack-Up
3.2.1
Six-Layer Motherboard Stack-Up
Figure 8 shows a six-layer stack-up for the system. It is for reference only and the actual board
stack-up may vary depending upon the following considerations. The separation between layers 2
and 3 should be kept as large as possible. A distance greater than 2x should be kept between
signals on layers 2 and signals on layer 3. Additionally, traces on layer 2 should be routed
orthogonally to traces on layer 3. If traces on layer 2 are unable to be routed orthogonally to traces
on layer 3, then the distance between layer 2 and layer 3 should be greater than 4x.
Figure 8. Six Layer Stack-Up
36
Layer 0
Vcc Plane
Layer 2
Layer 3
Vss Plane
Layer 5
®
®
Intel
Pentium
4 Processor / Intel
6 Layers
Layer 1
Layer 4
®
850 Chipset Family Platform Design Guide
Signal
Signal
Signal
Signal
6-Layer_stackup
R