Board And System Design Guidelines; Mechanical Design Considerations; Components Volumetric; Components Mass - Intel Xeon Phi Processor x200 Thermal/Mechanical Specification And Design Manual

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Board and System Design Guidelines

5
Board and System Design
Guidelines
5.1

Mechanical Design Considerations

The processor mechanical retention assembly design and reference thermal solution
provided are appropriate for a Intel Xeon Phi Processor x200 Product Family-based
platform reference board integrated into a half-width 1U air-cooled server rack
enclosure. Any use of these components in a platform or configuration different from
the Intel reference platform requires a complete thermal and mechanical design and
validation in accordance with the customer design criteria. Also, if customer thermal
and mechanical validation criteria differ from the Intel criteria, the reference solution
should be validated against the customers design criteria. In all cases, customers must
validate their thermal and mechanical solution in accordance with their design and
environmental validation criteria, and should not rely solely on these design guidelines.
5.1.1

Components Volumetric

The baseboard Keep-Out Zones (KOZs) on the primary and secondary sides and height
restrictions under the enabling component region are shown in detail in
The overall volumetric keep-in zone encapsulates the processor, socket, and the entire
thermal/mechanical enabling assembly.
5.1.2

Components Mass

The Static Compressive Load should also be considered in dynamic assessments.
Direct contact between back plate and chassis pan will usually help minimize board
deflection during shock.
Table 5-1.

LGA3647-1 Socket and Retention Component Mass

LGA3647-1 Socket Body, Contacts and PnP Cover
Backplate Assembly
Bolster Plate Assembly
Processor Package
Carrier
Heatsink
Notes:
1. May vary from supplier to supplier.
2. The reference heatsink mass is 424 g.
Order Number: 334785-002
Component
Intel
Mass
42 g (21 g per half)
134.8 g
62.1 g
Processor: 88.8 g
Processor with Fabric: 91.4 g
Processor: 6.8 g
Processor with Fabric: 6.2 g
< 600 g
® ®
Xeon Phi™ Processor x200 Product Family TMSDG
Appendix F.
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