3Com SuperStack II PathBuilder S330 Reference Manual page 222

Wan access switches
Hide thumbs Also See for SuperStack II PathBuilder S330:
Table of Contents

Advertisement

214
A
A: S
PPENDIX
YSTEM
S
P
N
PECIFICATIONS AND
ART
UMBERS
Table 15 PathBuilder S330 System Specifications (continued)
SYSTEM SPECIFICATIONS
Environmental:
Operating temperature
Storage temperature
Humidity
Altitude
Regulatory compliance
Safety
Emissions
STANDARDS
ATM Forum
ANSI
TIA/EIA
AT&T
Frame Relay Forum
IETF RFCs
MOTHERBOARD SPECIFICATIONS
Main microprocessor
Backplane speed
Memory usage
Front panel LEDs:
Common
Ethernet
Serial
OC3/STM-1
T1 (1-4)
Management Interface
Interface type
Connector type
(continued)
(continued)
0 °C to 45 °C (0 °F to 113 °F)
-40° to 70°C (-40 °F to 158°F)
95% @ 40°C ( 104 °F), non-condensing
14000 ft.
UL listed (1950, 3rd edition)
CSA 22.2
EN60950
FCC Part 68
FCC Part 15, Class A
EN 50082
EN 55022, Class A
UNI 3.x, T1/E1 CES 2.0, IMA, ATM DXI 1.0
T1.403, T1.617 Annex D
EIA -232, EIA-574, RS-366/422/423/449
Pubs 54016 and 62411
FRF.5, FRF.8, FRF.11
1213, 1211, 1483, 1490, 1406, 1493 (bridge MIB),
1577 (2225, IP over ATM), 1643 (Ethernet MIB)
RISC
360 MHz
Flash EPROM, 8 MB
DRAM, 16 MB
Power, Status, Alert
Tx, Rx, Link
TD, RD
Alert, Active
Alert, Active
RS-232C
Female DB-9

Advertisement

Table of Contents
loading

This manual is also suitable for:

Superstack ii pathbuilder s310

Table of Contents