Agilent Technologies 8564EC Service Manual page 202

Table 5-2 Abbreviations
A
ADJ
ANSI
ASSY
AWG
BCD
BD
BE-CU
BNC
BRG
BRS
BSC
BTN
Chapter 5
ABBREVIATIONS
A
Across Flats, C
Acrylic,
Air (Dry
Method),
Ampere
Adjust,
Adjustment
American
National
Standards CCP
Institute
(formerly
USASI-ASA) CD
Assembly
American CER
Wire Gage
CHAM
B CHAR
Binary Coded
Decimal
Board, Bundle CMOS
Beryllium
Copper
Type of
Connector
Bearing, CNDCT
Boring
Brass
Basic
Button
C CONT
Capacitance,
Capacitor,
Center Tapped, CONV
Cermet, Cold, CPRSN
Compression CUP-PT Cup Point
Carbon CW
Composition
Plastic
Cadmium, Card,
Cord
Ceramic
Chamfer D
Character,
Characteristic,
Charcoal DA
DAP-GL Diallyl
Complementary
Metal Oxide DBL
Semiconductor DCDR
Conducting, DEG
Conductive, D-HOLE D-Shaped
Conductivity, DIA
Conductor DIP
Replaceable Parts
Abbreviations
Contact,
Continuous,
Control,
Controller
Converter
Compression
Clockwise,
Continuous
Wave
D
Deep,
Depletion,
Depth,
Diameter,
Direct Current
Darlington
Phthalate
Glass
Double
Decoder
Degree
Hole
Diameter
Dual In-Line
Package
265