Sun Microsystems Enterprise 3500 System Reference Manual page 49

3.5.5.2 Installing a Memory Module
Requirements
The 2 Gbyte memory option (256 MByte DIMMs) require that the system flash
PROM software be 3.2.29 or compatible versions before installing memory
modules.
Currently, for Solaris 2.5.1 operating environments, configurations are limited to a
maximum total memory of 56 Gbyte, configurations that exceed 56GByte for this
version are not supported. Solaris 2.6 operating environments, together with
patch 105181-xx support a maximum configuration of 60 Gbyte. There is no
limitation for systems running Solaris 7 or 8 Operating Environments (maximum
achievable configuration is 60 Gbyte).
Do not mix different densities (128 or 256 Mbytes) in a bank.
For Solaris 2.5.1 Operating Environments the /usr/platform/sbin/prtdiag
command displays erroneous memory capacity information. Use software patch
104595-09 (available at http://sunsolve.sun.com) to correct this problem.
All banks must have the same size DIMMs. However, DIMMs from different
manufacturers are interchangeable in a single bank if the DIMMs all have the same
capacity and speed. Sort the DIMMs into banks of eight using the same size DIMMs.
Maximizing Performance
The following guidelines will result in optimal memory interleaving across boards
for performance. These guidelines are for optimal performance and are not
requirements for a functional system. The guidelines apply to systems with no
DIMMS installed and when adding DIMMs to a system. If you are adding DIMMs,
you may need to move some DIMMs to meet the guidelines.
1. Install one bank on each board before installing the second bank on any board.
It does not matter whether the first bank is bank 0 or bank 1.
2. Begin with the largest density banks first (256-Mbyte DIMMs) and finish with the
smallest banks (128-Mbyte DIMMs).
3. If there is remaining memory, start filling the second banks on the boards in the
same order as the first banks.
Installation
1. Place the CPU/Memory+ board on which the DIMM is to be installed on an
antistatic mat.
Chapter 3 CPU/Memory+ Boards and Components 3-17