Handling Boards And Assemblies - Sun Microsystems Enterprise 3500 System Reference Manual

3.1

Handling Boards and Assemblies

Caution – The chassis AC power cord must remain connected to ensure a proper
ground.
Caution – The CPU/Memory+ boards, their modules, and cards have surface-
mount components that can be broken by flexing the boards.
To minimize the amount of board flexing, observe the following precautions:
Transport the board in an antistatic bag.
When removing the board from an antistatic bag, keep the board vertical until
you lay it on the Sun antistatic mat.
Hold the board only by the edges near the middle of the board, where the board
stiffener is located. Do not hold the board only at the ends.
Do not place the board on a hard surface. Use a cushioned antistatic mat. The
board connectors and components have very thin pins that bend easily.
Do not use an oscilloscope probe on the components. The soldered pins are easily
damaged or shorted by the probe point.
Be careful of small parts located on the component side of the board.
Caution – The heatsinks on the board can be damaged by incorrect handling. Do
not touch the heatsinks while installing or removing the board. Hold the board only
by the edges. If a heatsink is loose or broken, obtain a replacement board.
Caution – The heatsinks on the board can be damaged by improper packaging.
When storing or shipping the board, ensure that the heatsinks have sufficient
protection.
Note – New system boards have square heatsinks, as depicted in this manual. All
boards prior to August 1999 have round heatsinks.
3-2 Sun Enterprise 3500 System Reference Manual • August 2001