Sun Microsystems Enterprise 3500 System Reference Manual page 45

Note – Screws on the UltraSPARC II modules must be tightened to 6 inch-pounds.
The torque screwdriver that came with your system is set to this specification.
1. Take the UltraSPARC II module out of the protective packaging and inspect for
dust on the connectors.
If necessary, clean the connectors with a dry, stiff toothbrush.
2. Remove the applicable CPU/Memory+ board as indicated in Section 3.5.1
"Removing a Board."
3. Inspect the board module mating surface and connectors. If they require cleaning,
use a dry, stiff toothbrush to remove debris.
Note – There are miniature silver alignment pins on the compression connectors
which, when the module is properly seated, align with related receptacles on the
mating surfaces of the CPU/Memory+ board. In addition, there is a gold standoff
mounted on the CPU/Memory+ board opposite the module's smaller board
connector. This acts as a standoff for the module as well as an alignment pin.
4. Holding the module by the edges, align the module over the two board
receptacles (use the single standoff and the alignment pins on the module
compression connector as a guide). See
5. Rest the module on the board standoff, aligning the compression connectors with
the screws.
Firmly but gently press the module straight down until the standoff post snaps into
place and the module connectors are fully seated.
6. Using the torque screwdriver provided with your system, tighten the screws in
three steps:
a. Tighten each screw in the sequence shown in figure 3-8 until it reaches the
metal plate.
and
FIGURE 3-6
Chapter 3 CPU/Memory+ Boards and Components
.
FIGURE 3-7
3-13