Lenovo HX3510-G Installation And Service Manual page 220

• Do not touch the microprocessor contacts; handle the microprocessor by the edges only. Contaminants
on the microprocessor contacts, such as oil from your skin, can cause connection failures between
the contacts and the socket.
Installation tool has two settings for installing two different sizes of microprocessors. The settings
that are marked on the tool are "L" for smaller low core microprocessors, and "H" for larger high core
microprocessors.
Installation tool
Microprocessor
Figure 166. Microprocessor installation tools
To remove a microprocessor and heat sink, complete the following steps:
Step 1. Read the safety information that begins on "Safety" on page v and "Removing and replacing
guidelines" on page 101.
Step 2. Turn off the server and peripheral devices and disconnect all power cords.
Step 3. Remove the top cover (see "Removing the top cover" on page 116).
Step 4. Remove the air baffle (see "Removing the air baffle" on page 119).
Step 5. Locate the microprocessor to be removed (see "System-board internal connectors" on page 23).
Step 6. If you are removing microprocessor 1, remove the memory modules from DIMM connectors 6 and
7. If you are removing microprocessor 2, remove the memory modules from DIMM connectors 18
and 19. See "Removing a memory module" on page 128 for instructions.
Step 7. Remove the heat sink.
Attention: Do not touch the thermal material on the bottom of the heat sink. Touching the thermal
material will contaminate it. If the thermal material on the microprocessor or heat sink becomes
contaminated, you must wipe off the contaminated thermal material on the microprocessor or heat
sink with the alcohol wipes and reapply clean thermal grease to the heat sink.
a. Open the heat sink retention module release lever to the fully open position.
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HX3510-G, HX5510, HX5510-C, HX7510 Installation and Service Guide