Processor
11.2.9 Applying the thermal paste to the processor
surface
I
For the Japanese market, the service engineer must follow the
instruction provided separately.
I
If the processor replacement kit contains a new heat sink, a thin layer of
thermal compound has already been pre-applied to its lower surface. In
this case, please proceed with section
page
290.
Figure 189: Thermal paste syringe
One thermal compound syringe (FTS-FSP:P304000004) contains thermal
paste for three processors.
288
Upgrade and Maintenance Manual
"Installing the heat sink" on
RX100 S7