Thermal Design; Thermal Characterization Parameter; Processor Thermal Characterization Parameter Relationships - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

7.5

Thermal Design

7.5.1

Thermal Characterization Parameter

The case-to-local ambient Thermal Characterization Parameter (Ψ
Equation 7-1. = (T
Ψ
CA
Where:
T
CASE
T
LA
TDP
Equation 7-2. = Ψ
Ψ
CA
Where:
Ψ
CS
Ψ
SA
Figure 7-5
Figure 7-5.

Processor Thermal Characterization Parameter Relationships

® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
59
- T ) / TDP
CASE LA
= Processor case temperature (°C). For T
Section 6.
= Local ambient temperature in chassis at processor (°C).
= TDP (W) assumes all power dissipates through the integrated heat
spreader. This inexact assumption is convenient for heatsink design.
TTVs are often used to dissipate TDP. Correction offsets account for
differences in temperature distribution between processor and TTV.
+ Ψ
CS SA
= Thermal characterization parameter of the TIM (°C/W) is dependent
on the thermal conductivity and thickness of the TIM.
= Thermal characterization parameter from heatsink-to-local ambient
(°C/W) is dependent on the thermal conductivity and geometry of the
heatsink and dependent on the air velocity through the heatsink fins.
illustrates the thermal characterization parameters.
Thermal Solutions
) is defined by:
CA
specification see
CASE
August 2010
Order Number: 323107-002US