Lga1366 Socket; Lga1366 Socket With Pick And Place Cover Removed - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

LGA1366 Socket

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LGA1366 Socket
This section describes a surface mount, LGA (Land Grid Array) socket intended for the
®
Intel Xeon
provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed
about a cavity in the center of the socket with lead-free solder balls for surface
mounting on the motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43 x 41
grid array with 21 x 17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Section 5.
Figure 3-1.

LGA1366 Socket with Pick and Place Cover Removed

August 2010
Order Number: 323107-002US
®
processor C5500/C3500 series in the Picket Post platform. The socket
package package
cavity cavity
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
socket socket
Thermal/Mechanical Design Guide
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