Thermal Design And Modelling; Thermal Solution Validation - Intel Core i7-800 Specifications

Figure 7-4. Required Ψ
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
Note: If an ambient of greater than 45.1 °C is necessary based on the boundary conditions a thermal solution
with a Ψ
7.3.2

Thermal Design and Modelling

Based on the boundary conditions the designer can now make the design selection of
the thermal solution components. The major components that can be mixed are the
fan, fin geometry, heat pipe or air cooled solid core design. There are cost and acoustic
trade-offs the customer can make.
7.3.3

Thermal Solution Validation

7.3.3.1 Test for Compliance with the TTV Thermal Profile
This step is the same as previously suggested for prior products. The thermal solution
is mounted on a test fixture with the TTV and tested at the following conditions:
• TTV is powered to the TDP condition
• Thermal solution fan operating at full speed
• T
AMBIENT
The following data is collected: TTV power, TTV T
calculate Ψ
This testing is best conducted on a bench to eliminate as many variables as possible
when assessing the thermal solution performance. The boundary condition analysis as
described in
52
for Various T
CA AMBIENT
Ψ-ca = 0.45
Ta = 30 °C
0 20
lower than 0.29 °C/W will be required.
CA
at the boundary condition from
which is defined as:
CA
Ψ = (TTV T – T
CA CASE
Section 7.3.1 should help in making the bench test simpler to perform.
Sensor Based Thermal Specification Design Guidance
Conditions
Ψ-ca = 0.40 Ψ-ca = 0.34
Ta = 35 °C Ta = 40 °C
40 60
TTV Power Dissipation (W)
Section 7.3.1
, and T
CASE
) / Power
AMBIENT
Thermal/Mechanical Specifications and Design Guidelines
Ψ-ca = 0.29
Ta = 45.1 °C
80
. This is used to
AMBIENT