Assembly; Ttv Die Size And Orientation; 1U Reference Heatsink Assembly - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual
Xeon processor c5500/c3500 series and lga1366 socket hermal/mechanical design guide
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Also See for X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor:
- Datasheet (104 pages) ,
- Specification (42 pages)
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Figure 7-3.
TTV Die Size and Orientation
Die CL
Package CL
7.3
Assembly
Figure 7-4.
1U Reference Heatsink Assembly
®
®
Intel
Xeon
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
57
Figure 1 - Side Views of Package with IHS (not to scale)
Cache Cache Cache Cache
Cache
Core
1.0
NOT TO SCALE
All Dimensions in mm
45
19.3
Order Number: 323107-002US
Thermal Solutions
August 2010
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