Socket Temperature Measurement Location - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

The socket maximum temperature is defined at Thermal Design Current (TDC). In
addition, the heatsink performance targets and boundary conditions of Table 6-1 must
be met to limit power dissipation through the socket.
To measure via temperature:
1. Drill a hole through the back plate at the specific via defined above.
2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the
specific via on the underside of the motherboard.
3. Once the glue dries, reinstall the back plate and measure the temperature.
Figure 5-1.

Socket Temperature Measurement Location

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Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
32
LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications
August 2010
Order Number: 323107-002US