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X3350 2.66 L2 1333MHz LGA775
Intel X3350 2.66 L2 1333MHz LGA775 Manuals
Manuals and User Guides for Intel X3350 2.66 L2 1333MHz LGA775. We have
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Intel X3350 2.66 L2 1333MHz LGA775 manual available for free PDF download: Design Manual
Intel X3350 2.66 L2 1333MHz LGA775 Design Manual (93 pages)
Xeon Processor C5500/C3500 Series and LGA1366 Socket hermal/Mechanical Design Guide
Brand:
Intel
| Category:
Computer Hardware
| Size: 2.84 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
8
Intel ® Xeon ® Processor C5500/C3500 Series Socket Stack-Up
8
Back Plate
8
Definition of Terms
9
Reference Documents
9
Terms and Descriptions
9
2 Package Mechanical Specifications
11
Processor Package Assembly Sketch
11
Package Mechanical Drawing
12
Processor Package Drawing (Sheet 1 of 2)
13
Processor Package Drawing (Sheet 2 of 2)
14
Processor Component Keep-Out Zones
15
Package Loading Specifications
15
Package Handling Guidelines
15
Package Insertion Specifications
15
Processor Loading Specifications
15
Processor Mass Specification
16
Processor Materials
16
Processor Markings
16
Processor Top-Side Markings
16
Processor Land Coordinates
17
Processor Land Coordinates and Quadrants, Bottom View
17
3 LGA1366 Socket
18
LGA1366 Socket with Pick and Place Cover Removed
18
LGA1366 Socket Contact Numbering (Top View of Socket)
19
Board Layout
20
LGA1366 Socket Land Pattern (Top View of Board)
20
Attachment to Motherboard
21
Socket Components
21
Socket Body Housing
21
Solder Balls
21
Contacts
22
Pick and Place Cover
22
Package Installation / Removal
23
Socket Standoffs and Package Seating Plane
23
Package Installation / Removal Features
23
Durability
24
Markings
24
Component Insertion Forces
24
Socket Size
24
LGA1366 Socket NCTF Solder Joints
24
LGA1366 NCTF Solder Joints
25
4 Independent Loading Mechanism (ILM)
26
Design Concept
26
ILM Cover Assembly Design Overview
26
ILM Back Plate Design Overview
27
ILM Cover Assembly
27
Assembly of ILM to a Motherboard
28
Back Plate
28
ILM Assembly
29
Pin1 and ILM Lever
30
5 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications
31
Component Mass
31
Package/Socket Stackup Height
31
Socket Maximum Temperature
31
Socket Component Mass
31
1366-Land Package and LGA1366 Socket Stackup Height
31
Socket Temperature Measurement Location
32
Loading Specifications
33
Board Deflection Guidance
33
Socket and ILM Mechanical Specifications
33
Electrical Requirements
34
Electrical Requirements for LGA1366 Socket
34
Environmental Requirements
35
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
35
6 Thermal Specifications
36
Package Thermal Specifications
36
Intel Xeon Processor EC5549 and EC5509 Thermal Profile
37
Processor EC5549 and EC5509 Thermal Specifications
37
Processor EC5549 and EC5509 Thermal Profile
38
Processor EC3539 and EC5539 Thermal Specifications
38
Processor EC3539 and EC5539 Thermal Profile
39
Processor LC5528 Thermal Profile
40
Processor LC5528 Thermal Specifications
40
Processor LC5528 Thermal Profile
41
Processor LC5518 Thermal Specifications
41
Processor LC5518 Thermal Profile
42
Processor P1053 Thermal Specifications
43
Processor P1053 Thermal Profile
43
Processor LC3528 Thermal Profile
44
Xeon Processor LC3518 Thermal Profile
44
Processor LC3528 Thermal Specifications
44
Processor LC3528 Thermal Profile
45
Processor LC3518 Thermal Specifications
45
Thermal Metrology
47
TTV Case Temperature (TCASE) Measurement Location
47
Processor Thermal Features
48
Processor Temperature
48
Adaptive Thermal Monitor
48
Frequency and Voltage Ordering
49
THERMTRIP# Signal
51
Platform Environment Control Interface (PECI)
51
Introduction
51
PECI Specifications
53
Gettemp0() Error Codes
53
7 Thermal Solutions
54
Performance Targets
54
Boundary Conditions and Performance Targets
54
1U Heatsink Performance Curves
55
Heat Pipe Considerations
56
ATCA Heatsink Performance Curves
56
Assembly
57
TTV die Size and Orientation
57
1U Reference Heatsink Assembly
57
Thermal Interface Material (TIM)
58
Structural Considerations
58
Thermal Design
59
Thermal Characterization Parameter
59
Processor Thermal Characterization Parameter Relationships
59
NEBS Thermal Profile
60
Power Thermal Utility
61
Thermal Features
61
Fan Speed Control
61
Fan Speed Control, TCONTROL and DTS Relationship
61
PECI Averaging and Catastrophic Thermal Management
62
Intel ® Turbo Boost Technology
62
TCONTROL Guidance
62
Absolute Processor Temperature
63
Custom Heat Sinks for up ATCA
63
UP ATCA Thermal Solution
64
UP ATCA System Layout
64
UP ATCA Heat Sink Drawing
65
8 Quality and Reliability Requirements
66
Use Conditions
66
Server Use Conditions Environment (System Level)
66
Intel Reference Component Validation
67
Board Functional Test Sequence
67
Server Use Conditions Environment (System Level)
67
Post-Test Pass Criteria
68
Recommended Bios/Processor/Memory Test Procedures
68
Material and Recycling Requirements
68
A Component Suppliers
70
Heatsinks and Thermal Interface Material
70
LGA1366 Socket and ILM Components
71
B Mechanical Drawings
72
Mechanical Drawing List
72
Board Keepin / Keepout Zones (Sheet 1 of 4)
73
Board Keepin / Keepout Zones (Sheet 2 of 4)
74
Board Keepin / Keepout Zones (Sheet 3 of 4)
75
Board Keepin / Keepout Zones (Sheet 4 of 4)
76
Reference Heatsink Assembly (Sheet 1 of 2)
77
Reference Heatsink Assembly (Sheet 2 of 2)
78
Reference Heatsink Fin and Base (Sheet 1 of 2)
79
Reference Heatsink Fin and Base (Sheet 2 of 2)
80
Heatsink Shoulder Screw (1U, 2U, and Tower)
81
Heatsink Compression Spring (1U, 2U, and Tower)
82
Heatsink Retaining Ring (1U, 2U, and Tower)
83
Heatsink Load Cup (1U, 2U, and Tower)
84
ATCA Reference Heatsink Assembly (Sheet 1 of 2)
85
ATCA Reference Heatsink Assembly (Sheet 2 of 2)
86
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)
87
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)
88
C Socket Mechanical Drawings
89
Mechanical Drawing List
89
Socket Mechanical Drawing - (Sheet 1 of 4)
90
Socket Mechanical Drawing - (Sheet 2 of 4)
91
Socket Mechanical Drawing - (Sheet 3 of 4)
92
Socket Mechanical Drawing - (Sheet 4 of 4)
93
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