Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual page 5

Figures
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1-1 Intel Xeon
2-1 Processor Package Assembly Sketch ......................................................................... 11
2-2 Processor Package Drawing (Sheet 1 of 2)................................................................. 13
2-3 Processor Package Drawing (Sheet 2 of 2)................................................................. 14
2-4 Processor Top-Side Markings ................................................................................... 16
2-5 Processor Land Coordinates and Quadrants, Bottom View ............................................ 17
3-1 LGA1366 Socket with Pick and Place Cover Removed .................................................. 18
3-2 LGA1366 Socket Contact Numbering (Top View of Socket) ........................................... 19
3-3 LGA1366 Socket Land Pattern (Top View of Board) ..................................................... 20
3-4 Attachment to Motherboard ..................................................................................... 21
3-5 Pick and Place Cover............................................................................................... 22
3-6 Package Installation / Removal Features ................................................................... 23
3-7 LGA1366 NCTF Solder Joints .................................................................................... 25
4-1 ILM Cover Assembly ............................................................................................... 27
4-2 Back Plate ............................................................................................................. 28
4-3 ILM Assembly ........................................................................................................ 29
4-4 Pin1 and ILM Lever................................................................................................. 30
5-1 Socket Temperature Measurement Location ............................................................... 32
5-2 Flow Chart of Knowledge-Based Reliability Evaluation Methodology ............................... 35
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6-1 Intel Xeon
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6-2 Intel Xeon
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6-3 Intel Xeon
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6-4 Intel Xeon
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6-5 Intel Celeron® Processor P1053 Thermal Profile ....................................................... 43
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6-6 Intel Xeon
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6-7 Intel Xeon
6-8 TTV Case Temperature (TCASE) Measurement Location ............................................... 47
6-9 Frequency and Voltage Ordering .............................................................................. 49
7-1 1U Heatsink Performance Curves.............................................................................. 55
7-2 ATCA Heatsink Performance Curves .......................................................................... 56
7-3 TTV Die Size and Orientation ................................................................................... 57
7-4 1U Reference Heatsink Assembly.............................................................................. 57
7-5 Processor Thermal Characterization Parameter Relationships........................................ 59
7-6 NEBS Thermal Profile .............................................................................................. 60
7-7 UP ATCA Thermal Solution....................................................................................... 64
7-8 UP ATCA System Layout.......................................................................................... 64
7-9 UP ATCA Heat Sink Drawing .................................................................................... 65
B-1 Board Keepin / Keepout Zones (Sheet 1 of 4) ............................................................ 73
B-2 Board Keepin / Keepout Zones (Sheet 2 of 4) ............................................................ 74
B-3 Board Keepin / Keepout Zones (Sheet 3 of 4) ............................................................ 75
B-4 Board Keepin / Keepout Zones (Sheet 4 of 4) ............................................................ 76
B-5 1U Reference Heatsink Assembly (Sheet 1 of 2) ......................................................... 77
B-6 1U Reference Heatsink Assembly (Sheet 2 of 2) ......................................................... 78
B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2)..................................................... 79
B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2)..................................................... 80
B-9 Heatsink Shoulder Screw (1U, 2U, and Tower) ........................................................... 81
B-10 Heatsink Compression Spring (1U, 2U, and Tower) ..................................................... 82
B-11 Heatsink Retaining Ring (1U, 2U, and Tower) ............................................................. 83
B-12 Heatsink Load Cup (1U, 2U, and Tower) .................................................................... 84
B-13 ATCA Reference Heatsink Assembly (Sheet 1 of 2)...................................................... 85
B-14 ATCA Reference Heatsink Assembly (Sheet 2 of 2)...................................................... 86
B-15 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ................................................. 87
B-16 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) ................................................. 88
August 2010
Order Number: 323107-002US
Processor C5500/C3500 Series Socket Stack-up ....................................... 8
Processor EC5549 and EC5509 Thermal Profile ....................................... 37
Processor EC3539 and EC5539 Thermal Profile ...................................... 39
Processor LC5528 Thermal Profile ......................................................... 40
Processor LC5518 Thermal Profile ......................................................... 42
Processor LC3528 Thermal Profile ......................................................... 44
Processor LC3518 Thermal Profile ......................................................... 46
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Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
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