Reference Documents; Definition Of Terms; Terms And Descriptions - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

1.1

Reference Documents

Material and concepts in the following documents may be beneficial when reading this
document.
Table 1-1.

Reference Documents

European Blue Angel Recycling Standards
Intel ® Xeon
Intel ® Xeon
®
Intel Xeon
®
Intel Xeon
Entry-level Electronics Bay Specification
Notes:
1. See http://developer.intel.com/design/intarch/xeon5000/documentation.htm
2. See http://www.intel.com/p/en_US/products/server/processor/xeon5000/tools
3. Available at
4. Available at
1.2

Definition of Terms

Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term
Bypass
DTS
FSC
IHS
ILM
IMON
LGA1366 socket
PECI
Ψ
CA
Ψ
CS
Ψ
SA
T
CASE
T _
CASE MAX
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
9
Document
® Processor C5500/C3500 Series Datasheet, Volume 1
® Processor C5500/C3500 Series Datasheet, Volume 2
®
Processor 5500 Series Mechanical Model
®
Processor 5500 Series Thermal Model
http://www.blauer-engel.de
http://ssiforum.oaktree.com/
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
Fan Speed Control
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
The current monitor input to the CPU. The VRM tells the CPU how much current it is
drawing.
The processor mates with the system board through this surface mount, 1366-land
socket.
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Package Power. Heat source should always be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Package Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
The maximum case temperature as specified in a component specification.
Document#
323103
323317
321326
321327
Description
CASE
CASE
– T ) / Total Package Power.
S LA
Order Number: 323107-002US
Introduction
Notes
3
1
1
2
2
4
– T ) / Total
LA
– T ) / Total
S
August 2010