Processor Ec5549 And Ec5509 Thermal Profile; Processor Ec3539 And Ec5539 Thermal Specifications - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Thermal Specifications
®
Table 6-2. Intel Xeon
®
Table 6-3. Intel Xeon
Core
Frequency
Launch to FMB
Notes:
1. These values are specified at V
the processor is not to be subjected to any static V
specified ICC. See the loadline specifications in the Datasheet.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in the Datasheet. The Intel
C3500 series Intel
frequency.
5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency
requirements.
August 2010
Order Number: 323107-002US
®

Processor EC5549 and EC5509 Thermal Profile

Power (W)
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
®

Processor EC3539 and EC5539 Thermal Specifications

Thermal Design Minimum
Power
(W)
65
CC_MAX
® ®
Xeon processor C5500/C3500 series may be shipped under multiple VIDs for each
T (°C)
CASE_MAX
51.8
53.3
54.8
56.3
57.9
59.4
60.9
62.4
63.9
65.4
67.0
68.5
70.0
71.5
73.0
74.5
76.0
77.6
Maximum
T T
CASE CASE
(°C) (°C)
5 See Figure 6-2;
for all processor frequencies. Systems must be designed to ensure
and I combination wherein V
CC CC
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Notes
Table 6-4 1, 2, 3, 4, 5
exceeds V
CC CC_MAX
.
CASE
® ®
Xeon processor C5500/
Thermal/Mechanical Design Guide
at
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