Page 1 ® Intel Core™2 Extreme Quad- ® Core Processor and Intel Core™2 Quad Processor Thermal and Mechanical Design Guidelines Supporting: ® Δ  Intel Core™2 Extreme quad-core processor QX6000 series at 775_VR_CONFIG_05B ® Δ  Intel Core™2 Quad processor Q6000 series at 105 W ®...
Page 2 Intel provides this information for customer’s convenience only. Use at your own risk. Intel accepts no liability for results if customer chooses at its discretion to implement these methods within its business operations. Intel makes no representations or warranties regarding the accuracy or completeness of the information provided.
Page 3: Table Of Contents
Contents Introduction ....................11 Document Goals and Scope ..............11 1.1.1 Importance of Thermal Management ..........11 1.1.2 Document Goals..............11 1.1.3 Document Scope ..............12 References ..................13 Definition of Terms ................14 Processor Thermal/Mechanical Information ............17 Mechanical Requirements ..............17 2.1.1 Processor Package..............17 2.1.2 Heatsink Attach ..............19 2.1.2.1 General Guidelines ............19 2.1.2.2...
Page 4 Fan Hub Thermistor and Intel QST ............62 Appendix A LGA775 Socket Heatsink Loading ..............63 LGA775 Socket Heatsink Considerations ..........63 ® Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel Reference Design .................63 A.2.1 Heatsink Preload Requirement Limitations........63 A.2.2 Motherboard Deflection Metric Definition........64 A.2.3...
Page 5 Cleaning and Completion of Thermocouple Installation....93 Thermocouple Wire Management ............96 Appendix E Balanced Technology Extended (BTX) System Thermal Considerations....99 Appendix F Mechanical Drawings ..................103 ® Appendix G Intel Enabled Reference Solution Information ..........123 Thermal and Mechanical Design Guidelines...
Page 6 ® Figure 10. Intel RCFH-4 Reference Design - Exploded View ......... 43 Figure 11. Intel D60188-001 Reference Design ─ Exploded View......44 Figure 12. Bottom View of Copper Core Applied by TC-1996 Grease .......45 Figure 13. Random Vibration PSD..............49 Figure 14. Shock Acceleration Curve ..............50 Figure 15.
Page 7 Figure 69. Reference Fastener - Sheet 2............115 Figure 70. Reference Fastener - Sheet 3............116 Figure 71. Reference Fastener - Sheet 4............117 ® Figure 72. Intel RCFH4 Reference Solution Assembly ........118 ® Figure 73. Intel RCFH4 Reference Solution Assembly - Page 2 ......119 ®...
Page 8 Tables Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions....27 ® Table 2. Heatsink Inlet Temperature of Intel Boxed Processor thermal solutions ..27 Table 3. ATX Reference Heatsink Performance (RCFH-4) for 775_VR_CONFIG 05B Processors ..................45 Table 4. ATX Reference Heatsink Performance (D60188-001) for Listed Processors at 95 W................46...
Page 9 Date Number -001  Initial Release. November 2006 ® -002  Added specifications for Intel Core™2 Quad Processor January 2007 Q6600 -003  Updated QX6800 series at the 775_VR_CONFIG_05B July 2007 thermal information  Updated Q6000 series at 105 W thermal information ...
Page 10 Thermal and Mechanical Design Guidelines...
Page 11: Introduction
The concepts given in this document are applicable to any system form factor. Specific examples used will be the Intel enabled reference solution for ATX/uATX systems. See the applicable BTX form factor reference documents to design a thermal solution for that form factor.
Page 12: Document Scope
Core™2 Extreme quad-core processors QX6850, QX6800, and QX6700 ® ®  Intel Core™2 Quad processor Q6000 series at 105 W applies to the Intel Core™2 Quad processor Q6600 ® ®  Intel Core™2 Quad processor Q6000 series at 95 W applies to the Intel Core™2...
Page 13: References
Core™2 Quad Processor Q9000, Q9000S, Q8000, ocessor/datashts/318726.htm   and Q8000S Series Datasheet ® ® Intel Core™2 Duo Processor E8000 and E7000 Series and Intel www.intel.com/design/processo ® Pentium Dual-Core Processor E5000 Series Thermal and r/designex/318734.htm Mechanical Design Guide http://developer.intel.com/desig LGA775 Socket Mechanical Design Guide n/Pentium4/guides/302666.htm...
Page 14: Definition Of Terms
Introduction Definition of Terms Term Description ACPI Advanced Configuration and Power Interface. Balanced Technology Extended Bypass is the area between a passive heatsink and any object that can act Bypass to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.
Page 15 Introduction Term Description Thermal A feature on the processor that attempts to keep the processor die Monitor temperature within factory specifications. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.
Page 16 Introduction Thermal and Mechanical Design Guidelines...
Page 17: Processor Thermal/Mechanical Information
Processor Thermal/Mechanical Information Processor Thermal/Mechanical Information Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket.
Page 18 Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device.
Page 19: Heatsink Attach
Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no features on the LGA775 socket to directly attach a heatsink: a mechanism must be designed to attach the heatsink directly to the motherboard. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular: ...
Page 20: Additional Guidelines
Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guidelines:  Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material.
Page 21: Thermal Profile
Core™2 Quad processor Q6000 series at 105 W, an active air-cooled design in an ATX Chassis, with a fan installed at the top of the ® heatsink equivalent to the RCBFH-3 reference design (see the document of Intel ® Pentium...
Page 22 For Balanced Technology Extended (BTX) platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type I reference design (see the document of Balanced Technology Extended (BTX) System Design Guide ) should be designed to manage the processor TDP at an inlet temperature of 35 ºC + 0.5 ºC = 35.5 ºC.
Page 23: Control
0 via the digital thermometer. As a result the value will always be a negative number. See Chapter 4 for the discussion of CONTROL ® the thermal management logic and features and Chapter 6 on Intel Quiet System ® Technology (Intel QST).
Page 24: Heatsink Design Considerations
See the appropriate processor datasheet for further details on reading the register and calculating T CONTROL ® ® See Chapter 6 Intel Quiet System Technology (Intel QST) for details on implementing a design using T and the Thermal Profile.
Page 25: Heatsink Size
This mass includes the fan and the heatsink only. The attach mechanism (clip, fasteners, etc.) are not included. The mass limit for BTX heatsinks that use Intel reference design structural ingredients is 900 grams. The BTX structural reference component strategy and design is...
Page 26: Package Ihs Flatness
The package IHS flatness for the product is specified in the datasheet and can be used as a baseline to predict heatsink performance during the design phase. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink loading.
Page 27: System Thermal Solution Considerations
35.5 °C Temperature NOTE: Intel reference designs (D60188-001 and RCBFH-3) are assumed be used in the chassis where expected the temperature rise is 5 °C. Intel reference design (RCFH-4) is assumed be used in the thermally advantaged chassis and expected some of the temperature rise is induced by processor heat recirculation (refer to Thermally Advantaged Chassis version 1.1 for Thermally...
Page 28: Summary
Socket documentation provides Best Known Methods for all aspects LGA775 socket based platforms and systems manufacturing. Of particular interest for package and heatsink installation and removal is the System Assembly module. A video covering system integration is also available. Contact your Intel field sales representative for further information. §...
Page 29: Thermal Metrology
Thermal Metrology Thermal Metrology This chapter discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”,  (“psi”) will be used. Characterizing Cooling Performance Requirements The idea of a “thermal characterization parameter”, ...
Page 30: Figure 4. Processor Thermal Characterization Parameter Relationships
Thermal Metrology The case-to-local ambient thermal characterization parameter of the processor,  , is comprised of  , the thermal interface material thermal characterization parameter, and of  , the sink-to-local ambient thermal characterization parameter:  =  +  (Equation 2) Where: ...
Page 31: Example
Assessment Thermal performance of a heatsink should be assessed using a thermal test vehicle (TTV) provided by Intel. The TTV is a stable heat source that the user can make accurate power measurement, whereas processors can introduce additional factors that can impact test results. In particular, the power level from actual processors varies significantly, even when running the maximum power application provided by Intel, due to variances in the manufacturing process.
Page 32: Local Ambient Temperature Measurement Guidelines
Thermal Metrology Local Ambient Temperature Measurement Guidelines The local ambient temperature T is the temperature of the ambient air surrounding the processor. For a passive heatsink, T is defined as the heatsink approach air temperature; for an actively cooled heatsink, it is the temperature of inlet air to the active cooling fan.
Page 33: Figure 5. Locations For Measuring Local Ambient Temperature, Active Heatsink
Thermal Metrology Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink NOTE: Drawing Not to Scale Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink NOTE: Drawing Not to Scale Thermal and Mechanical Design Guidelines...
Page 34: Processor Case Temperature Measurement Guidelines
Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when T is maintained at or below the thermal profile as listed in the datasheet. The measurement location for T is the geometric center of the IHS. Figure 2 shows the location for T measurement.
Page 35: Thermal Management Logic And Thermal Monitor Feature
In the absence of power saving technologies, ever increasing frequencies will result in processors with power dissipations in the hundreds of watts. Fortunately, there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using more power efficient circuits can significantly reduce processor power consumption.
Page 36: Prochot# Signal
Thermal Management Logic and Thermal Monitor Feature 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is to provide an external indication the processor has reached the TCC activation temperature. While PROCHOT# is asserted, the TCC will be active. Assertion of the PROCHOT# signal is independent of any register settings within the processor.
Page 37: Thermal Monitor 2 (Tm2)
Thermal Management Logic and Thermal Monitor Feature Figure 7. Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.2.2 Thermal Monitor 2 (TM2) The second method of power reduction is TM2. TM2 provides an efficient means of reducing the power consumption within the processor and limiting the processor temperature.
Page 38: Operation And Configuration
Thermal Management Logic and Thermal Monitor Feature Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to insure proper operation once the processor reaches its normal operating frequency.
Page 39: On-Demand Mode
4.2.5 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a well designed processor thermal solution.
Page 40: Operating System And Application Software Considerations
Thermal Management Logic and Thermal Monitor Feature control circuit to activate under normal operating conditions. Systems that do not meet these specifications could be subject to more frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile. Moreover, if a system is significantly under designed, there is a risk that the Thermal Monitor feature will not be capable of reducing the processor power and temperature and the processor could shutdown and signal THERMTRIP#.
Page 41: Digital Thermal Sensor
Thermal Management Logic and Thermal Monitor Feature 4.2.9 Digital Thermal Sensor Multiple digital thermal sensors can be implemented within the package without adding a pair of signal pins per sensor as required with the thermal diode. The digital thermal sensor is easier to place in thermally sensitive locations of the processor than the thermal diode.
Page 42: Platform Environmental Control Interface (Peci)
Set Overview. For additional information on the PECI, see the Datasheet. The PECI bus is available on pin G5 of the LGA 775 socket. Intel chipsets beginning with the ICH8 have included PECI host controller. The PECI interface and the ®...
Page 43: Intel Thermal/Mechanical Reference Design Information
RCFH-4 Reference Design - Exploded View Fan Assy. Fan Assy. Wire Guard Wire Guard Extrusion Extrusion Fastener Fastener Clip Clip ® Note: Development vendor information for the Intel RCFH-4 Reference Solution is provided in 0. Thermal and Mechanical Design Guidelines...
Page 44: Figure 11. Intel D60188-001 Reference Design ─ Exploded View
® ® The Intel Core™2 Quad processor Q6000 series at 95 W and Intel Core™2 Quad processor Q9000 and Q8000 series at 95 W require a thermal solution equivalent to the D60188-001 reference design (see Figure 11 for an exploded view of this reference design).
Page 45: Validation Results For Reference Design
Section 5.2.4. The tables includes a T assumption of 39 °C and 40 °C for the Intel reference thermal solution at the processor fan heatsink inlet discussed in Section 2.4.1. Table 3. ATX Reference Heatsink Performance (RCFH-4) for 775_VR_CONFIG 05B...
Page 46: Acoustics
Intel ® Core™2 Quad Processor Q6000 0.33 C/W = 40 C  series at 95 W and Intel® Core™2  Quad processor Q9000 and Q8000 series at 95 W NOTES: Performance targets (Ψ ca) as measured with a live processor at TDP.
Page 47: Altitude
Section 2.2.3. Intel recommendation is to use the CONTROL Fan Specification for 4 Wire PWM Controlled Fans to implement fan speed control capability based on the digital thermal sensor.
Page 48: Fan Performance For Active Heatsink Thermal Solution
Intel® Thermal/Mechanical Reference Design Information 5.2.5 Fan Performance for Active Heatsink Thermal Solution The fan power requirements for proper operation are given Table 7. Table 7. Fan Electrical Performance Requirements Requirement Value Maximum Average fan current draw 1.5 A Fan start-up current draw 2.2 A...
Page 49: Environmental Reliability Testing
Intel® Thermal/Mechanical Reference Design Information Environmental Reliability Testing 5.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements.
Page 50: Recommended Test Sequence
Intel® Thermal/Mechanical Reference Design Information Figure 14. Shock Acceleration Curve Time (m illiseconds) 5.3.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e. motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/Memory test (refer to Section 5.3.3).
Page 51: Power Cycling
Intel® Thermal/Mechanical Reference Design Information 5.3.2 Power Cycling Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The test is defined by 7500 cycles for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP.
Page 52: Safety Requirements
Intel® Thermal/Mechanical Reference Design Information Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards:  UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved.
Page 53: Reference Attach Mechanism
191.3 N ± 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference design, in particular the clip and fastener.
Page 54: Mechanical Interface To The Reference Attach Mechanism
Intel® Thermal/Mechanical Reference Design Information 5.7.2 Mechanical Interface to the Reference Attach Mechanism The attach mechanism component from the reference design can be used by other 3 party cooling solutions. The attach mechanism consists of:  A metal attach clip that interfaces with the heatsink core, see Appendix F Figure 66 and Figure 67 for the component drawings.
Page 55: Figure 17. Critical Parameters For Interfacing To Reference Clip
Intel® Thermal/Mechanical Reference Design Information Figure 17. Critical Parameters for Interfacing to Reference Clip Fin Array Fin Array Core Core See Detail A See Detail A Clip Clip Fin Array Fin Array Fin Array Fin Array Fin Array Fin Array 1.6 mm...
Page 56 Intel® Thermal/Mechanical Reference Design Information Thermal and Mechanical Design Guidelines...
Page 57: Intel Quiet System Technology (Intel Qst)
The ME provides integrated fan speed control in lieu of the mechanisms available in a SIO or a stand-alone ASIC. The Intel QST is time based as compared to the linear or state control used by the current generation of FSC devices.
Page 58: Output Weighting Matrix
6.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans. An example of how the matrix could be used is if a sensor located next to the memory is sensitive to changes in both the processor heatsink fan and a 2 fan in the system.
Page 59: Figure 20. Pid Controller Fundamentals
Intel® Quiet System Technology (Intel® QST) Figure 20. PID Controller Fundamentals Integral (time averaged) Integral (time averaged) Integral (time averaged) Integral (time averaged) Actual Actual Temperature Temperature Limit Limit Proportional Proportional Proportional Proportional Temperature Temperature Error Error Error Error Derivative (Slope)
Page 60: Board And System Implementation Of Intel
To implement the board must be configured as shown in Figure 21 and listed below:  ME system (S0–S1) with Controller Link connected and powered  DRAM with Channel A DIMM 0 installed and 2 MB reserved for Intel QST FW execution  SPI Flash with sufficient space for the Intel QST Firmware ...
Page 61: Figure 22. Example Acoustic Fan Speed Control Implementation
(see Appendix E for BTX recommendations for placement). Figure 22. Example Acoustic Fan Speed Control Implementation Intel has engaged with a number of major manufacturers of thermal / voltage sensors to provide devices for the SST bus. Contact your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for your design.
Page 62: Intel ® Qst Configuration And Tuning
® Fan Hub Thermistor and Intel There is no closed loop control between Intel QST and the thermistor, but they can work in tandem to provide the maximum fan speed reduction. The BTX reference design includes a thermistor on the fan hub. This Variable Speed Fan curve will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a ...
Page 63: Appendix Alga775 Socket Heatsink Loading
Mechanical shock and vibration and TIM performance AND LGA775 socket protection against fatigue failure. Metric for Heatsink Preload for ATX/uATX ® Designs Non-Compliant with Intel Reference Design A.2.1 Heatsink Preload Requirement Limitations Heatsink preload by itself is not an appropriate metric for solder joint force across...
Page 64: Motherboard Deflection Metric Definition
LGA775 Socket Heatsink Loading Simulation shows that the solder joint force (F ) is proportional to the board axial deflection measured along the socket diagonal. The matching of F required to axial protect the LGA775 socket solder joint in temperature cycling is equivalent to matching a target MB deflection.
Page 65: Board Deflection Limits
LGA775 Socket Heatsink Loading Figure 24. Board Deflection Definition d’1 d’2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref ≥ 0.09 mm d_EOL - d_ref ≥ 0.15 mm d’_BOL – d’_ref ≥ 0.09 mm d_EOL’...
Page 66: Board Deflection Metric Implementation Example
LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions:  72 mm x 72 mm hole pattern of the reference design  Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep over time ...
Page 67: Additional Considerations
Figure 25. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends to design to {d_BOL – d_ref = 0.15mm} at BOL when EOL conditions are not known or difficult to assess. The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness.
Page 68: Motherboard Stiffening Considerations
 The Boxed Processor  The reference design (RCFH-4, RCBFH-3 and D60188-001) Intel will collaborate with vendors participating in its third party test house program to ® evaluate third party solutions. Vendor information is available in Intel Core™2 Quad Processor Support Components webpage www.intel.com/go/thermal_Core2Quad.
Page 69: Appendix B Heatsink Clip Load Metrology
Heatsink preload for the LGA775 socket  Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. Updates will be provided later as this document is revised as appropriate.
Page 70: Figure 26. Load Cell Installation In Machined Heatsink Base Pocket (Bottom View)
Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design ...
Page 71: Figure 27. Load Cell Installation In Machined Heatsink Base Pocket (Side View)
Heatsink Clip Load Metrology Figure 27. Load Cell Installation in Machined Heatsink Base Pocket (Side View) Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 28.
Page 72: Typical Test Equipment
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed Table 9. Table 9. Typical Test Equipment Item Description Part Number (Model) Load cell Honeywell*-Sensotec* Model 13 subminiature AL322BL load cells, compression only Notes: 1, 5...
Page 73: Time-Zero, Room Temperature Preload Measurement
Heatsink Clip Load Metrology B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis  For example: standard ATX board should sit on ATX compliant stand-offs. If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism.
Page 74 Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines...
Page 75: Appendix C Thermal Interface Management
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution.
Page 76 Thermal Interface Management § Thermal and Mechanical Design Guidelines...
Page 77: Case Temperature Reference Metrology
Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775-land LGA package for T measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is intended.
Page 78: Thermal Calibration And Controls
It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process.
Page 79: Ihs Groove
Case Temperature Reference Metrology IHS Groove Cut a groove in the package IHS; see the drawings given in Figure 30 and Figure 31. The groove orientation in Figure 30 is toward the IHS notch to allow the thermocouple wire to be routed under the socket lid. This will protect the thermocouple from getting damaged or pinched when removing and installing the heatsink (see Figure 55).
Page 83: Figure 32. Ihs Groove At 6 O'clock Exit On The 775-Land Lga Package
Case Temperature Reference Metrology The orientation of the groove at 6 o’clock exit relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 32 for the 775-Land LGA package IHS. Figure 32. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is parallel to the...
Page 84: Thermocouple Attach Procedure
Case Temperature Reference Metrology Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 – 155 °C. Note: To avoid damage to the TTV or processor ensure the IHS temperature does not exceed 155 °C.
Page 85: Thermocouple Attachment To The Ihs
Case Temperature Reference Metrology Figure 35. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. Clean groove and IHS with Isopropyl Alcohol (IPA) and a lint free cloth removing all residues prior to thermocouple attachment. 7. Place the thermocouple wire inside the groove; letting the exposed wire and bead extend about 1.5 mm [0.030 inch] past the end of groove.
Page 86: Figure 37. Thermocouple Bead Placement
Case Temperature Reference Metrology 9. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS (see Figure 37-A and B). Figure 37.
Page 87: Figure 38. Position Bead On The Groove Step
Case Temperature Reference Metrology 11. While still at the microscope, press the wire down about 6mm [0.125”] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (see Figure 38). Refer to Figure 39 for detailed bead placement.
Page 88: Figure 40. Third Tape Installation
Case Temperature Reference Metrology Figure 40. Third Tape Installation 12. Place a 3 piece of tape at the end of the step in the groove as shown in Figure 40. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process.
Page 89: Figure 42. Applying Flux To The Thermocouple Bead
Case Temperature Reference Metrology 14. Using a fine point device, place a small amount of flux on the thermocouple bead. Be careful not to move the thermocouple bead during this step (see Figure 42). Ensure the flux remains in the bead area only. Figure 42.
Page 90: Solder Process
Case Temperature Reference Metrology 16. Place the two pieces of solder in parallel, directly over the thermocouple bead (see Figure 44) Figure 44. Positioning Solder on IHS 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the IHS.
Page 91: Figure 45. Solder Station Setup
Case Temperature Reference Metrology Figure 45. Solder Station Setup 21. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper heater block at any time as this is very hot.
Page 92: Figure 46. View Through Lens At Solder Station
Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (see Figure 46 and Figure 47). Figure 46.
Page 93: Cleaning And Completion Of Thermocouple Installation
Case Temperature Reference Metrology 25. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder. Figure 48. Removing Excess Solder 26.
Page 94: Figure 49. Thermocouple Placed Into Groove
Case Temperature Reference Metrology Figure 49. Thermocouple Placed into Groove 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (see Figure 50). Figure 50. Removing Excess Solder Note: Take usual precautions when using open blades.
Page 95: Figure 51. Filling Groove With Adhesive
Case Temperature Reference Metrology Figure 51. Filling Groove with Adhesive 32. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (see Figure 52). Figure 52. Application of Accelerant Figure 53.
Page 96: Thermocouple Wire Management
Case Temperature Reference Metrology 33. Using a blade, carefully shave any adhesive that is above the IHS surface (see Figure 53). The preferred method is to shave from the edge to the center of the IHS. Note: The adhesive shaving step should be performed while the adhesive is partially cured, but still soft.
Page 97: Figure 55. Thermocouple Wire Management
Case Temperature Reference Metrology Figure 55. Thermocouple Wire Management § Thermal and Mechanical Design Guidelines...
Page 98 Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines...
Page 99: Appendix E Balanced Technology Extended (Btx) System Thermal Considerations
Balanced Technology Extended (BTX) System Thermal Considerations Appendix E Balanced Technology Extended (BTX) System Thermal Considerations There are anticipated system operating conditions in which the processor power may be low but other system component powers may be high. If the only Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor diode then the fan speed and system airflow is likely to be too low in this operating state.
Page 100: Figure 56. System Airflow Illustration With System Monitor Point Area Identified
Balanced Technology Extended (BTX) System Thermal Considerations The thermal sensor location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 56 and Figure 57).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following...
Page 101: Figure 57. Thermal Sensor Location Illustration
Balanced Technology Extended (BTX) System Thermal Considerations Figure 57. Thermal Sensor Location Illustration Thermal Sensor MCH Heatsink § Thermal and Mechanical Design Guidelines...
Page 102 Balanced Technology Extended (BTX) System Thermal Considerations Thermal and Mechanical Design Guidelines...
Page 103: Appendix F Mechanical Drawings
The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description Page Number ATX/µATX Motherboard Keep-out Footprint Definition and Height...
Page 104 47.50 45.26 40.00 39.01 36.78 36.00 32.51 27.81 27.51 23.47 7.30 2 0.00 5.90 ) 16.87 23.47 27.00 27.51 32.51 36.49 33.00 36.78 36.00 40.00 39.01 44.00 45.26 47.50...
Page 122 Mechanical Drawings Thermal and Mechanical Design Guidelines...
Page 123: Intel Enabled Reference Solution Information
Cap: C33390 Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.
Page 124: Table 12. D60188-001 Reference Thermal Solution Providers
Schmidt Cap: C33390 Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.

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Bx80580q8300 - core 2 quad 2.5 ghz processor Bx80562q6600 - core 2 quad 2.4 ghz processor Q6700 - core 2 quad processor Q9400s - core 2 quad 2.66ghz 6m l2 cache 1333mhz lga775 low power processor Core2 extreme quad-core qx6000 series Core2 quad q6000 series ... Show all

Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

1 Introduction

2 Processor Thermal/Mechanical Information

3 Thermal Metrology

4 Thermal Management Logic and Thermal Monitor Feature

5 Intel Thermal/Mechanical Reference Design Information

6 Intel Quiet System Technology (Intel QST)

Appendix Alga775 Socket Heatsink Loading

Appendix B Heatsink Clip Load Metrology

Appendix C Thermal Interface Management

Appendix D Case Temperature Reference Metrology

Appendix E Balanced Technology Extended (BTX) System Thermal Considerations

Appendix F Mechanical Drawings

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