2.1.1
Package Mechanical Drawing
The package mechanical drawings are shown in
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm
®
®
Intel
Xeon
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
12
Package Mechanical Specifications
Figure 2-2
and
Figure
2-3. The
Order Number: 323107-002US
August 2010