Processor Lc5518 Thermal Profile - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Thermal Specifications
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Figure 6-4. Intel Xeon
Notes:
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1. Intel
See Table 6-8
2. Implementation of Intel
in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet this Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
3. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 360 hours per year per year, as compliant with NEBS Level 3. Operation at the
Short-Term Thermal Profile for durations exceeding 360 hours per year violate the processor thermal
specifications and may result in permanent damage to the processor.
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Table 6-8. Intel Xeon
August 2010
Order Number: 323107-002US
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Processor LC5518 Thermal Profile

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Xeon processor LC5518 Thermal Profile is representative of a volumetrically constrained platform.
for discrete points that constitute the thermal profile.
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Xeon processor LC5518 nominal and short-term thermal profiles should result
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Processor LC5518 Thermal Profile

Power (W) Nominal T
0
5
10
15
20
25
30
35
40
48
Short-term T
(°C)
CASE_MAX
52.0
54.7
57.3
60.0
62.6
65.3
68.0
70.6
73.3
77.5
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Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
CASE_MAX
(°C)
67.0
69.7
72.3
75.0
77.6
80.3
83.0
85.6
88.3
92.5
Thermal/Mechanical Design Guide
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