Assembly Of Ilm To A Motherboard; Back Plate - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Independent Loading Mechanism (ILM)
Figure 4-2.

Back Plate

4.2

Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. In
step 1 (see
provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed
over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover
assembly to the back plate with the four captive fasteners. Torque to 8 inch-pounds.
The length of the threaded studs accommodate board thicknesses from 0.062" -
0.100".
August 2010
Order Number: 323107-002US
Figure 4-3), the back plate is placed in a fixture. Holes in the motherboard
Clearance hole
Clearance hole Clearance hole
Threaded nuts
Threaded nuts Threaded nuts
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Threaded studs Threaded studs
Threaded studs
Thermal/Mechanical Design Guide
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