Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual
Xeon processor c5500/c3500 series and lga1366 socket hermal/mechanical design guide
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Summary of Contents for Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor
- Page 1 ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. The code name “Picket Post" presented in this document are only for use by Intel to identify products, technologies, or services in development, that have not been made commercially available to the public, i.e., announced, launched or shipped.
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Page 3: Table Of Contents
Thermal Specifications ................36 6.1.2 Thermal Metrology ................. 47 Processor Thermal Features ................48 6.2.1 Processor Temperature ................48 6.2.2 Adaptive Thermal Monitor................ 48 ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... - Page 4 7.6.4 Absolute Processor Temperature ...............63 7.6.5 Custom Heat Sinks For UP ATCA ...............63 Quality and Reliability Requirements ...............66 Use Conditions ....................66 Intel Reference Component Validation ..............67 8.2.1 Board Functional Test Sequence ...............67 8.2.2 Post-Test Pass Criteria................68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures ......68 Material and Recycling Requirements..............68...
- Page 5 Figures ® ® Intel Xeon Processor C5500/C3500 Series Socket Stack-up ........8 Processor Package Assembly Sketch ................. 11 Processor Package Drawing (Sheet 1 of 2)..............13 Processor Package Drawing (Sheet 2 of 2)..............14 Processor Top-Side Markings ................... 16 Processor Land Coordinates and Quadrants, Bottom View ..........17 LGA1366 Socket with Pick and Place Cover Removed ..........
- Page 6 ® Intel Xeon Processor LC5518 Thermal Profile ............42 ® ® Intel Celeron Processor P1053 Thermal Specifications ..........43 ® ® 6-10 Intel Celeron Processor P1053 Thermal Profile............43 ® ® 6-11 Intel Xeon Processor LC3528 Thermal Specifications ..........44 ® ® 6-12 Intel Xeon Processor LC3528 Thermal Profile ............45...
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Page 7: Revision History
Modified Table 5-3, Socket and ILM Mechanical Specifications August 2010 Modified Section 7.6.1, Fan Speed Control First release February 2010 § § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 8: Introduction
Socket and ILM Back Plate The goals of this document are: • To assist board and system thermal mechanical designers. • To assist designers and suppliers of processor heatsinks. Other processor specifications are provided in the Intel ® Xeon ® Processor C5500/ C3500 Series Datasheet. -
Page 9: Reference Documents
The processor mates with the system board through this surface mount, 1366-land socket. PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Ψ Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. - Page 10 A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US...
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Page 11: Package Mechanical Specifications
Capacitors LGA1366 Socket System Board System Board Note: Socket and motherboard are included for reference and are not part of processor package. ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 12: Package Mechanical Drawing
2. IHS parallelism and tilt 3. Land dimensions 4. Top-side and back-side component keep-out dimensions 5. Reference datums 6. All drawing dimensions are in mm ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 13: Processor Package Drawing (Sheet 1 Of 2)
Package Mechanical Specifications Figure 2-2. Processor Package Drawing (Sheet 1 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 14: Processor Package Drawing (Sheet 2 Of 2)
Package Mechanical Specifications Figure 2-3. Processor Package Drawing (Sheet 2 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 15: Processor Component Keep-Out Zones
The processor can be inserted into and removed from a LGA1366 socket 15 times. The socket should meet the LGA1366 requirements detailed in Section ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 16: Processor Mass Specification
This diagram is to aid in the identification of the processor. Figure 2-4. Processor Top-Side Markings GRP1LINE1 Legend: Mark Text (Engineering Mark): GRP1LINE2 GRP1LINE1: INTEL{M}{C}’YY GRP1LINE2: INTEL CONFIDENTIAL GRP1LINE3: QDF ES XXXXX GRP1LINE4: FORECAST-NAME GRP1LINE5: {FPO} {e4} Legend: Mark Text (Production Mark): GRP1LINE1: INTEL{M}{C}’YY PROC#... -
Page 17: Processor Land Coordinates
The coordinates are referred to throughout the document to identify processor lands. Figure 2-5. Processor Land Coordinates and Quadrants, Bottom View § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 18: Lga1366 Socket
This section describes a surface mount, LGA (Land Grid Array) socket intended for the ® ® Intel Xeon processor C5500/C3500 series in the Picket Post platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. -
Page 19: Lga1366 Socket Contact Numbering (Top View Of Socket)
LGA1366 Socket Figure 3-2. LGA1366 Socket Contact Numbering (Top View of Socket) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 20: Board Layout
The 40 mil spacing results in a reduced drill keepout as compared to previous ® ® platforms. Drill keepout is explained in section 3.2.1 of the Intel Xeon 5500 Platform Design Guide (PDG). Select PCB suppliers are capable of producing 40 mil spacing. -
Page 21: Attachment To Motherboard
(ImAg) motherboard surface finish and a SAC alloy solder paste. The co-planarity (profile) and true position requirements are defined in Appendix ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 22: Contacts
3-5, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket. Figure 3-5. Pick and Place Cover ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 23: Package Installation / Removal
Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard. ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 24: Durability
LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. -
Page 25: Lga1366 Nctf Solder Joints
AB AD AF AH AK AM AP AT AV AY BB Note: For platforms supporting the DP processor land C3 is CTF. § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 26: Independent Loading Mechanism (Ilm)
Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. -
Page 27: Ilm Back Plate Design Overview
An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is pre- applied. Back plates for processors in 1-socket workstation platforms are covered in the Intel ® ®... -
Page 28: Assembly Of Ilm To A Motherboard
Torque to 8 inch-pounds. The length of the threaded studs accommodate board thicknesses from 0.062” - 0.100”. ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide... -
Page 29: Ilm Assembly
Independent Loading Mechanism (ILM) Figure 4-3. ILM Assembly ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 30: Pin1 And Ilm Lever
ILM lever. See the Manufacturing Advantage Service for additional details on fixtures and assembly guidance. Figure 4-4. Pin1 and ILM Lever § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 31: Lga1366 Socket And Ilm Electrical, Mechanical And Environmental Specifications
The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the... -
Page 32: Socket Temperature Measurement Location
3. Once the glue dries, reinstall the back plate and measure the temperature. Figure 5-1. Socket Temperature Measurement Location ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 33: Loading Specifications
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits. -
Page 34: Electrical Requirements
The bulk resistance increase per contact from 24° C to 107° C Dielectric Withstand Voltage 360 Volts RMS Insulation Resistance 800 MΩ ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 35: Environmental Requirements
Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology is at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide... -
Page 36: Thermal Specifications
Section 6.1.1 Thermal Specifications To allow the optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the minimum and maximum case temperature (T ) specifications as defined by the applicable thermal profile. -
Page 37: Intel Xeon Processor Ec5549 And Ec5509 Thermal Profile
These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. ® ® Power specifications are defined at all VIDs found in the Datasheet. The Intel Xeon processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. -
Page 38: Processor Ec5549 And Ec5509 Thermal Profile
These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. ® ® Power specifications are defined at all VIDs found in the Datasheet. The Intel Xeon processor C5500/ ® ®... -
Page 39: Intel
EC3539 and EC5539 Thermal Profile is representative of a volumetrically unconstrained platform. See Table 6-4 for discrete points that constitute the thermal profile. ® ® Implementation of Intel Xeon processor EC3539 and EC5539 Thermal Profile should result in virtually no TCC activation. ® ®... -
Page 40: Processor Lc5528 Thermal Profile
These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. ® ® Power specifications are defined at all VIDs found in the Datasheet. The Intel Xeon processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. -
Page 41: Processor Lc5528 Thermal Profile
These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. ® ® Power specifications are defined at all VIDs found in the Datasheet. The Intel Xeon processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. -
Page 42: Processor Lc5518 Thermal Profile
Table 6-8 for discrete points that constitute the thermal profile. ® ® Implementation of Intel Xeon processor LC5518 nominal and short-term thermal profiles should result in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet this Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss. -
Page 43: Intel
These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. ® ® Power specifications are defined at all VIDs found in the Datasheet. The Intel Xeon processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. -
Page 44: Processor Lc3528 Thermal Profile
These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. ® ® Power specifications are defined at all VIDs found in the Datasheet. The Intel Xeon processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. -
Page 45: Processor Lc3528 Thermal Profile
These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. ® ® Power specifications are defined at all VIDs found in the Datasheet. The Intel Xeon processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. - Page 46 Table 6-14 for discrete points that constitute the thermal profile. ® ® Implementation of Intel Xeon processor LC3518 nominal and short-term thermal profiles should result in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet this Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss.
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Page 47: Thermal Metrology
C2: Max = 36.6 mm, Min = 36.4 mm. C3: Max = 2.3 mm, Min = 2.2 mm C4: Max = 2.3 mm, Min = 2.2 mm. ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010... -
Page 48: Processor Thermal Features
6.2.1 Processor Temperature ® ® A new feature in the Intel Xeon processor C5500/C3500 series is a software readable field in the IA32_TEMPERATURE_TARGET register that contains the minimum temperature at which the TCC will be activated and PROCHOT# will be asserted. The... -
Page 49: Frequency And Voltage Ordering
VID codes to reach the target ® ® operating voltage. Each step will be one VID table entry (see the Intel Xeon Processor C5500/C3500 Series Datsheet). The processor continues to execute instructions during the voltage transition. - Page 50 Systems ® ® utilizing the Intel Xeon Processor 5500 Series must not rely on software usage of this mechanism to limit the processor temperature. If bit 4 of the IA32_CLOCK_MODULATION MSR is set to a ‘1’, the processor will immediately reduce...
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Page 51: Thermtrip# Signal
Introduction The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. The processor implements a PECI interface to allow communication of processor thermal and other information to other devices on the platform. The processor provides a digital thermal sensor (DTS) on each core for fan speed control. - Page 52 Of course, fan control chips can also monitor the Prochot pin to detect TCC activation via a dedicated input pin on the package. ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide...
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Page 53: Peci Specifications
• Address 31h when PECI_ID# is terminated to ground. 6.3.2.2 PECI Command Support ® ® PECI commands are in the Intel Xeon Processor C5500/C3500 Series Datasheet). 6.3.2.3 PECI Fault Handling Requirements PECI is largely a fault tolerant interface, including noise immunity and error checking improvements over other comparable industry standard interfaces. -
Page 54: Thermal Solutions
Other Intel Xeon Processor 5500 Series ® ® thermal solutions may work with the same retention. See the Intel Xeon Processor 5500 Series Thermal/Mechanical Design Guide. Note: Custom heatsinks and high airflow ATCA designs can cool higher power processors than typical ATCA. -
Page 55: 1U Heatsink Performance Curves
Mean Ψ Ψ -0.817 -0.817 = 0.1430 + 1.141*CFM = 0.1430 + 1.141*CFM σ = 0.0016 C/W 0.15 0.00 CFM Through Fins ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 56: Heat Pipe Considerations
Figure 7-3 shows the orientation and position of the TTV die. The TTV die is sized and positioned similar to the processor die. ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 57: Assembly
Cache Cache Cache Cache Cache Die CL Core Package CL 19.3 NOT TO SCALE All Dimensions in mm Assembly Figure 7-4. 1U Reference Heatsink Assembly ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 58: Thermal Interface Material (Tim)
The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct ® ® Chassis Attach retention (as used with previous Dual-Core Intel Xeon processor 5000 sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock. -
Page 59: Thermal Design
Figure 7-5 illustrates the thermal characterization parameters. Figure 7-5. Processor Thermal Characterization Parameter Relationships ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 60: Nebs Thermal Profile
NEBS Thermal Profile Note: ® ® 1.) The thermal specifications shown in this graph are for reference only. See the Intel Xeon Processor C5500/ C3500 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the Datasheet supersedes any data in this figure. -
Page 61: Power Thermal Utility
Tcase within specification for the Thermal Design Power (TDP) as specified in Section 6. Contact your Intel representative to obtain the latest revision of the PTU. The default power level from the drop down list represents TDP. -
Page 62: Peci Averaging And Catastrophic Thermal Management
Heatsink performance (lower Ψ as described in Section 7.5.1) is one of several ® ® factors that can impact the amount of Intel TBT frequency benefit. Intel performance is also constrained by ICC, and VCC limits. ® ® Intel Xeon... -
Page 63: Absolute Processor Temperature
Absolute Processor Temperature Intel does not test any third-party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading. -
Page 64: Up Atca Thermal Solution
Thermal sample only, retention not production ready. Figure 7-8. UP ATCA System Layout Airflow direction Note: Heatsink should be optimized for the layout. ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 65: Up Atca Heat Sink Drawing
Thermal Solutions Figure 7-9. UP ATCA Heat Sink Drawing § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 66: Quality And Reliability Requirements
Quality and Reliability Requirements Quality and Reliability Requirements Use Conditions Intel evaluates reliability performance based on the use conditions (operating environment) of the end product by using acceleration models. The use condition environment definitions provided in Table 8-1 Table 8-2 based on speculative use condition assumptions, and are provided only as examples. -
Page 67: Intel Reference Component Validation
• Random control limit tolerance is ± 3 dB Intel Reference Component Validation Intel tests reference components individually and as an assembly on mechanical test boards and assesses performance to the envelopes specified in previous sections by varying boundary conditions. -
Page 68: Post-Test Pass Criteria
• All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions, and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test. - Page 69 (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. Note: RoHS implementation details are not fully defined and may change. § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US...
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Page 70: A Component Suppliers
Component Suppliers Component Suppliers The part numbers below represent Intel reference designs and collaborative designs for 1U and ATCA heatsinks. These components are still in development and might not meet the criteria in Section 8. Customer implementation of these components may be unique and require validation by the customer. -
Page 71: Lga1366 Socket And Ilm Components
Component Suppliers Table A-2. LGA1366 Socket and ILM Components Item Intel PN Foxconn Tyco ILM Cover Assembly D92428-002 PT44L12-4101 1939738-1 Server Back Plate D92433-002 PT44P12-4101 1981467-1 LGA1366 Socket D86205-002 PE136627-4371-01F 1939737-1 or 1981837-1 Julia Jiang Billy Hsieh Supplier Contact Info juliaj@foxconn.com... -
Page 72: B Mechanical Drawings
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Figure B-15 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) Figure B-16 ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 73: Board Keepin / Keepout Zones (Sheet 1 Of 4)
Mechanical Drawings Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 74: Board Keepin / Keepout Zones (Sheet 2 Of 4)
0.8661 [ 22.000 BALL 0.755 [ 19.17 0.484 [ 12.30 0.378 [ 9.60 0.295 [ 7.50 0.000 [ 0.00 0.197 [ 5.00 ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 75: Board Keepin / Keepout Zones (Sheet 3 Of 4)
Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4) 0.197 [ 5.00 0.000 [ 0.00 0.374 [ 9.50 1.293 [ 32.85 1.856 [ 47.15 2.776 [ 70.50 3.346 [ 85.00 ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 76: Board Keepin / Keepout Zones (Sheet 4 Of 4)
Mechanical Drawings Figure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 77: Reference Heatsink Assembly (Sheet 1 Of 2)
Mechanical Drawings Figure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 78: Reference Heatsink Assembly (Sheet 2 Of 2)
Mechanical Drawings Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 79: Reference Heatsink Fin And Base (Sheet 1 Of 2)
Mechanical Drawings Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 80: Reference Heatsink Fin And Base (Sheet 2 Of 2)
Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 81: Heatsink Shoulder Screw (1U, 2U, And Tower)
Mechanical Drawings Figure B-9. Heatsink Shoulder Screw (1U, 2U, and Tower) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 82: Heatsink Compression Spring (1U, 2U, And Tower)
Mechanical Drawings Figure B-10. Heatsink Compression Spring (1U, 2U, and Tower) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 83: Heatsink Retaining Ring (1U, 2U, And Tower)
Mechanical Drawings Figure B-11. Heatsink Retaining Ring (1U, 2U, and Tower) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 84: Heatsink Load Cup (1U, 2U, And Tower)
Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U, and Tower) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 85: Atca Reference Heatsink Assembly (Sheet 1 Of 2)
Mechanical Drawings Figure B-13. ATCA Reference Heatsink Assembly (Sheet 1 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 86: Atca Reference Heatsink Assembly (Sheet 2 Of 2)
Mechanical Drawings Figure B-14. ATCA Reference Heatsink Assembly (Sheet 2 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 87: Atca Reference Heatsink Fin And Base (Sheet 1 Of 2)
Mechanical Drawings Figure B-15. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 88: Atca Reference Heatsink Fin And Base (Sheet 2 Of 2)
Mechanical Drawings Figure B-16. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 89: C Socket Mechanical Drawings
Figure C-2 “Socket Mechanical Drawing - (Sheet 3 of 4)” Figure C-3 “Socket Mechanical Drawing - (Sheet 4 of 4)” Figure C-4 ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 90: Socket Mechanical Drawing - (Sheet 1 Of 4)
Socket Mechanical Drawings Figure C-1. Socket Mechanical Drawing - (Sheet 1 of 4) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 91: Socket Mechanical Drawing - (Sheet 2 Of 4)
Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing - (Sheet 2 of 4) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US... -
Page 92: Socket Mechanical Drawing - (Sheet 3 Of 4)
Socket Mechanical Drawings Figure C-3. Socket Mechanical Drawing - (Sheet 3 of 4) ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US... -
Page 93: Socket Mechanical Drawing - (Sheet 4 Of 4)
Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing - (Sheet 4 of 4) § ® ® Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket August 2010 Thermal/Mechanical Design Guide Order Number: 323107-002US...