Processor Lc5528 Thermal Profile; Processor Lc5518 Thermal Specifications - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

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Table 6-6. Intel Xeon
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Table 6-7. Intel Xeon
Core
Frequency
Launch to FMB
Notes:
1. These values are specified at V
the processor is not to be subjected to any static V
specified ICC. See the loadline specifications in the Datasheet.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4. Power specifications are defined at all VIDs found in the Datasheet. The Intel
C3500 series may be shipped under multiple VIDs for each frequency.
5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency
requirements.
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Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
41
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Processor LC5528 Thermal Profile

Power (W) Nominal T
0
5
10
15
20
25
30
25
40
45
50
55
60
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Processor LC5518 Thermal Specifications

Thermal Design Minimum
Power
(W)
48
CC_MAX
Short-term T
(°C)
CASE_MAX
51.9
53.4
54.9
56.4
57.9
59.5
61.0
62.5
64.0
65.5
67.0
68.5
70.0
Maximum
T T
CASE CASE
(°C) (°C)
5 See Figure 6-4;
for all processor frequencies. Systems must be designed to ensure
and I combination wherein V
CC CC
Thermal Specifications
CASE_MAX
(°C)
66.9
68.4
69.9
71.4
72.9
74.5
76.0
77.5
79.0
80.5
82.0
83.5
85.0
Notes
Table 6-8 1, 2, 3, 4, 5
exceeds V
CC CC_MAX
.
CASE
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Xeon processor C5500/
August 2010
Order Number: 323107-002US
at