Processor Mass Specification; Processor Materials; Processor Markings; Processor Top-Side Markings - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual
Xeon processor c5500/c3500 series and lga1366 socket hermal/mechanical design guide
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Also See for X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor:
- Datasheet (104 pages) ,
- Specification (42 pages)
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2.1.6
Processor Mass Specification
The typical mass of the processor is 35 grams. This mass [weight] includes all the
components that are included in the package.
2.1.7
Processor Materials
Table 2-3
Table 2-3.
Processor Materials
Integrated Heat Spreader (IHS)
Substrate
Substrate Lands
2.1.8
Processor Markings
Figure 2-4
identification of the processor.
Figure 2-4.
Processor Top-Side Markings
®
®
Intel
Xeon
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
16
lists some of the package components and associated materials.
Component
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
shows the topside markings on the processor. This diagram is to aid in the
GRP1LINE1
GRP1LINE2
G2L1
G3L1
G2L2
G3L2
Package Mechanical Specifications
Material
Legend:
Mark Text (Engineering Mark):
GRP1LINE1:
INTEL{M}{C}'YY
GRP1LINE2:
INTEL CONFIDENTIAL
GRP1LINE3:
QDF ES XXXXX
GRP1LINE4:
FORECAST-NAME
GRP1LINE5:
{FPO} {e4}
Legend:
Mark Text (Production Mark):
GRP1LINE1:
INTEL{M}{C}'YY PROC#
GRP1LINE2:
SUB-BRAND
GRP1LINE3:
SSPEC XXXXX
GRP1LINE4:
SPEED/CACHE/INTC
GRP1LINE5:
{FPO} {e4}
Order Number: 323107-002US
August 2010
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