Ilm Back Plate Design Overview; Ilm Cover Assembly - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Figure 4-1.

ILM Cover Assembly

4.1.2

ILM Back Plate Design Overview

The unified back plate for 2-socket server and 2-socket Workstation products consists
of a flat steel back plate with threaded studs for ILM attach, and internally threaded
nuts for heatsink attach. The threaded studs have a smooth surface feature that
provides alignment for the back plate to the motherboard for proper assembly of the
ILM around the socket. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors. An additional cut-out on two sides
provides clearance for backside voltage regulator components. An insulator is pre-
applied.
Back plates for processors in 1-socket workstation platforms are covered in the Intel
®
Xeon Processor 3500 Series Thermal/Mechanical Design Guide.
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
27
Independent Loading Mechanism (ILM)
Order Number: 323107-002US
®
August 2010