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Intel 5400 Series Design Manuallines

Intel 5400 Series Design Manuallines

Quad-core processor thermal/mechanical design guidelines
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Quad-Core Intel
Xeon
Processor
®
®
5400 Series
Thermal/Mechanical Design Guidelines
November 2007
Reference Number: 318611 Revision: 001

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Summary of Contents for Intel 5400 Series

  • Page 1 Quad-Core Intel Xeon Processor ® ® 5400 Series Thermal/Mechanical Design Guidelines November 2007 Reference Number: 318611 Revision: 001...
  • Page 2 The Quad-Core Intel® Xeon® 5400 Series may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

  • Page 3: Table Of Contents

    Heatsink Solutions... 37 2.5.2 Thermal Interface Material... 38 2.5.3 Summary ... 38 2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design... 39 2.5.5 Thermal Solution Performance Characteristics ... 41 2.5.6 Thermal Profile Adherence ... 42 2.5.7 Components Overview ... 45 2.5.8...
  • Page 4 F.1.2 Additional Suppliers ...96 Figures Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3)...15 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3)...16 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3)...17 Processor Case Temperature Measurement Location ...19 DTS Domain for Quad-Core Intel®...
  • Page 5 B-24 1U Alternative Heatsink (4 of 4) ... 81 Load Cell Installation in Machined Heatsink Base Pocket - Bottom View... 84 Load Cell Installation in Machined Heatsink Base Pocket - Side View... 85 Preload Test Configuration... 85 Quad-Core Intel® Xeon® Processor 5400 Series TMDG...
  • Page 6 Reference Documents... 9 Terms and Descriptions ...10 Processor Mechanical Parameters Table ...13 Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Management Features ...22 Processor Core Geometric Center Dimensions ...23 Intel Reference Heatsink Performance Targets for the Quad-Core Intel®...

  • Page 7: Revision History

    Revision History Reference Revision Description Date Number Number 318611 Initial release of the document. November 2007 § Quad-Core Intel® Xeon® Processor 5400 Series TMDG...
  • Page 8 Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 9: Introduction

    Scope The thermal/mechanical solutions described in this document pertain to a solution(s) intended for use with the Quad-Core Intel® Xeon® Processor 5400 Series in 1U, 2U, 2U+ and workstation form factors systems. This document contains the mechanical and thermal requirements of the processor cooling solution. In case of conflict, the data in the Quad-Core Intel®...

  • Page 10: Definition Of Terms

    Thin Electronics Bay Specification (A Server System Infrastructure (SSI) Specification for Rack Optimized Servers Note: Contact your Intel field sales representative for the latest revision and order number of this document. Definition of Terms Table 1-2. Terms and Descriptions (Sheet 1 of 2)
  • Page 11 CONTROL OFFSET Thermal Monitor Thermal Profile Quad-Core Intel® Xeon® Processor 5400 Series TMDG A processor unique value for use in fan speed control mechanisms. T temperature specification based on a temperature reading from the processor’s Digital Thermal Sensor. T can be described as a trigger point for fan speed control CONTROL implementation.
  • Page 12 Introduction Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 13: Thermal/Mechanical Reference Design

    Notes: Refer to drawings in In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in These socket limits are defined in the LGA771 Socket Mechanical Design Guide.

  • Page 14: Quad-Core Intel® Xeon® Processor 5400 Series Package

    2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The Quad-Core Intel®...

  • Page 15: Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 Of 3)

    Thermal/Mechanical Reference Design Figure 2-1. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3) Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution are available in the processor Thermal/Mechanical Design Guidelines.

  • Page 16: Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 Of 3)

    Thermal/Mechanical Reference Design Figure 2-2. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 17: Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 Of 3)

    Thermal/Mechanical Reference Design Figure 2-3. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3) Note: The optional dimple packing marking highlighted by Detail F from the above drawing may only be found on initial processors. Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 18: Quad-Core Intel® Xeon® Processor 5400 Series Considerations

    LGA771 Socket Mechanical Design Guide. The processor package and socket have mechanical load limits that are specified in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and the LGA771 Socket Mechanical Design Guide. These load limits should not be exceeded during heatsink installation, removal, mechanical stress testing, or standard shipping conditions.

  • Page 19: Processor Thermal Parameters And Features

    The Intel reference design for Quad-Core Intel® Xeon® Processor 5400 Series is using such a heatsink attachment scheme. Refer to regarding the Intel reference mechanical solution.

  • Page 20: Digital Thermal Sensor

    Datasheet. In addition, on-die thermal management features called THERMTRIP# and FORCEPR# are available on the Quad-Core Intel® Xeon® Processor 5400 Series. They provide a thermal management approach to support the continued increases in processor frequency and performance. Please see the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for guidance on these thermal management features.

  • Page 21: Platform Environmental Control Interface (Peci)

    Thermal Sensors located on the die. Each die within the processor currently maps to a PECI domain. The Quad-Core Intel® Xeon® Processor 5400 Series contains two cores per die (domain) and two domains (die) per socket. BIOS will be responsible for detecting the proper processor type and providing the number of domains to the thermal management system.

  • Page 22: Input And Output Conditions For The Quad-Core Intel® Xeon® Processor 5400 Series Thermal Management Features

    FORCEPR# Asserted FORCEPR# Note: X=1,2,3,4; represents any one of the core1, core2, core3 and core4 in the Quad-Core Intel® Xeon® Processor 5400 Series. For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet.

  • Page 23: Processor Core Geometric Center Locations

    Figure 2-6. Processor Core Geometric Center Locations Table 2-3. Processor Core Geometric Center Dimensions Feature Core 1 Core 2 Core 3 Core 4 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Core4 Core4 Core3 Core3 Core2 Core2 Core1 Core1 X1, X2, X3, X4...

  • Page 24: Thermal Profile

    (°C) CASE ) and the lower end point represents CASE_MAX (refer to Section 2.2.6). The Thermal Profile allows the Section 2.4.3). There can be multiple combinations of thermal Quad-Core Intel® Xeon® Processor 5400 Series TMDG 2-7. The equation of the...

  • Page 25: Tcontrol Definition

    Digital Thermal Sensor Tcontrol = -5 Tcontrol = -5 The value for T CONTROL individually. For the Quad-Core Intel® Xeon® Processor 5400 Series, the T value is obtained by reading the processor model specific register (IA32_TEMPERATURE_TARGET MSR). Note: There is no T...

  • Page 26: Thermal Profile Concepts For The Quad-Core Intel® Xeon® Processor 5400 Series

    Dual Thermal Profile Concept for the X5400 Series The Quad-Core Intel® Xeon® Processor X5400 Series is designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. Due to certain limitations of such form factors (i.e. airflow, thermal solution height), it is very challenging to meet the thermal requirements of the processor.

  • Page 27: Dual Thermal Profile Diagram

    The Thermal Profile A is based on Intel’s 2U+ air cooling solution. Designing to Thermal Profile A ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activation is observed in the processor. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition.

  • Page 28: Performance Targets

    Section 2.2.8 for the Thermal Profile A and Thermal Profile B specifications. of this document also provides details on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A and Thermal Profile B respectively.

  • Page 29: Thermal Profile For The Quad-Core Intel® Xeon® Processor X5400 Series

    Figure 2-11. Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series Notes: The The thermal specifications shown in this graph are for Quad-Core Intel® Xeon® Processor X5400 Series except the Quad-Core Intel® Xeon® Processor X5482 sku. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specifications.

  • Page 30: Thermal Profile For Quad-Core Intel® Xeon® Processor E5400 Series

    Figure 2-12. Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series Note: The thermal specifications shown in this graph are for reference only. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the datasheet supersedes any data in this figure.

  • Page 31: Thermal Profile For Quad-Core Intel® Xeon® Processor X5482 Series

    Thermal/Mechanical Reference Design Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series Table 2-4 Table 2-5 Intel® Xeon® Processor 5400 Series cooling solution enabled by Intel. Table 2-4. Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5400 Series...

  • Page 32: Fan Fail Guidelines

    Series] at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 80% of the TDP limit for Quad-Core Intel® Xeon® Processor X5400 Series with 120W TDP and 90% of the TDP limit for Quad-Core Intel®...

  • Page 33: Characterizing Cooling Solution Performance Requirements

    T control scheme can be implemented as described in the long-term reliability of the processor. Quad-Core Intel® Xeon® Processor 5400 Series TMDG Section 2.2.6, is to be used in FSC designs to ensure that the...

  • Page 34: Processor Thermal Characterization Parameter Relationships

    FSC should adjust fan speed to keep T specification (increased acoustic region). drives fans to maximum RPM. If FSC is CONTROL ) / TDP Quad-Core Intel® Xeon® Processor 5400 Series TMDG Thermal/Mechanical Reference Design (low acoustic region). CONTROL at or below the Thermal Profile CASE value for a given processor.

  • Page 35: Processor Thermal Characterization Parameter Relationships

    The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only. Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 36: Chassis Thermal Design Considerations

    ≤ 0.05 °C/W, solving for equation (2-4) from above, the performance = 0.27 − 0.05 = 0.22 °C/W ) / TDP = (68 – 40) / 85 = 0.33 °C/W Quad-Core Intel® Xeon® Processor 5400 Series TMDG Thermal/Mechanical Reference Design rise...

  • Page 37: Thermal/Mechanical Reference Design Considerations

    Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins. Quad-Core Intel® Xeon® Processor 5400 Series TMDG Section 2.5.2 for further information...

  • Page 38: Thermal Interface Material

    Socket Mechanical Design Guide. value of a given processor can decrease over time depending on for information on the TIM used in the Intel reference heatsink at the heatsink, airflow (CFM), the power being (case to air thermal characterization parameter). More information is given in Section 2.5...

  • Page 39: Assembly Overview Of The Intel Reference Thermal Mechanical Design

    Assembly Overview of the Intel Reference Thermal Mechanical Design The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the following components: •...
  • Page 40 CEK (Pro/Engineer*, IGES and Icepak*, Flotherm* formats). Pro/Engineer, Icepak and Flotherm models are available on Intel Business Link (IBL). Note: Intel reserves the right to make changes and modifications to the design as necessary. Note: The thermal mechanical reference design for the Quad-Core Intel® Xeon® Processor...

  • Page 41: Thermal Solution Performance Characteristics

    Figure 2-17. 2U+ CEK Heatsink Thermal Performance If other custom heatsinks are intended for use with the Quad-Core Intel® Xeon® Processor 5400 Series, they must support the following interface control requirements to be compatible with the reference mechanical components: •...

  • Page 42: Thermal Profile Adherence

    2.5.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor 5400 Series. From sigma (mean+3sigma) performance of the thermal solution is computed to be 0.187 °C/W and the processor local ambient temperature (T...

  • Page 43: Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A

    Series Thermal Profile A @ TDP CASE_MAX_B The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5400 Series. From sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246°C/W and the processor local ambient temperature (T...

  • Page 44: Cek Thermal Adherence To Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B

    Series Thermal Profile B @ TDP CASE_MAX_B The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246 °C/W and the processor local ambient temperature (T...

  • Page 45: Components Overview

    Thermal/Mechanical Reference Design Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile CASE_MAX Note: Intel has also developed an 1U alternative reference heatsink design. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel®...

  • Page 46: Isometric View Of The 2U+ Cek Heatsink

    20.64 mm [0.8125 in.]. Thermal/Mechanical Reference Design for more detailed mechanical drawings of the heatsink. for more detailed mechanical drawings of the heatsink. Quad-Core Intel® Xeon® Processor 5400 Series TMDG The standoff will...

  • Page 47: Cek Heatsink Thermal Mechanical Characteristics

    The CEK reference solution is designed to apply a compressive load of up to 133 N [30 lbf] on the TIM to improve the thermal performance. Quad-Core Intel® Xeon® Processor 5400 Series TMDG Appendix E. Some of the thermal and mechanical...

  • Page 48: Cek Spring Isometric View

    Appendix B Also, the baseboard keepout requirements shown in this CEK spring design. Thermal/Mechanical Reference Design Primary Primary for more detailed mechanical drawings of the CEK spring. Appendix B Quad-Core Intel® Xeon® Processor 5400 Series TMDG must be met to use...

  • Page 49: Boxed Active Thermal Solution For The Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile

    Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed Quad-Core Intel® Xeon® Processor 5400 Series. This active heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue.

  • Page 50: Fan Power Supply

    Figure 2-27. Fan Cable Connection (Active CEK) Thermal/Mechanical Reference Design Appendix B. Refer to Steady Steady Startup 10.8 13.2 1.25 with a resistor. Quad-Core Intel® Xeon® Processor 5400 Series TMDG Figure B-18 through Table 2-9 Unit Notes Pulses per fan revolution...

  • Page 51: Fan Cable Connector Pin Out (Active Cek)

    The boxed processor will include the following items: • Quad-Core Intel® Xeon® Processor 5400 Series • Unattached heatsink solution • 4 screws, 4 springs, and 4 heatsink standoffs (all captive to the heatsink) •...
  • Page 52 They are as follows: • CEK Spring (supplied by baseboard vendors) • Heatsink standoffs (supplied by chassis vendors) Thermal/Mechanical Reference Design Figure 2-16 that are required to complete this solution will be § Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 53: A-1 Isometric View Of The 1U Alternative Heatsink

    Quad-Core Intel® Xeon® Processor E5400 Series thermal profile specifications. Component Overview The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive standoff/screws, Thermal Interface Material (TIM) and Spring. Figure A-1 shows the isometric view of the 1U alternative heatsink.

  • Page 54: A-1 1U Alternative Heatsink Thermal Mechanical Characteristics

    [1.06] Thermal Profile Adherence The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form factors. From Table A-1 solution is computed to be 0.331 °C/W and the processor local ambient temperature ) for this thermal solution is 40 °C.

  • Page 55: A-3 1U Alternative Heatsink Thermal Adherence To Quad-Core Intel® Xeon Processor L5400 Series Thermal Profile

    Figure A-3 below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.
  • Page 56 1U Alternative Heatsink Thermal/Mechanical Design Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 57: B Mechanical Drawings

    The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series. Note: Intel reserves the right to make changes and modifications to the design as necessary. Table B-1. Mechanical Drawing List “2U CEK Heatsink (Sheet 1 of 4)”...

  • Page 58: Cek Heatsink (Sheet 1 Of 4)

    Mechanical Drawings Figure B-1. 2U CEK Heatsink (Sheet 1 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 59: Cek Heatsink (Sheet 2 Of 4)

    Mechanical Drawings Figure B-2. 2U CEK Heatsink (Sheet 2 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 60: Cek Heatsink (Sheet 3 Of 4)

    Mechanical Drawings Figure B-3. 2U CEK Heatsink (Sheet 3 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 61: Cek Heatsink (Sheet 4 Of 4)

    Mechanical Drawings Figure B-4. 2U CEK Heatsink (Sheet 4 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 62: B-5 Cek Spring (Sheet 1 Of 3)

    Mechanical Drawings Figure B-5. CEK Spring (Sheet 1 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 63: B-6 Cek Spring (Sheet 2 Of 3)

    Mechanical Drawings Figure B-6. CEK Spring (Sheet 2 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 64: B-7 Cek Spring (Sheet 3 Of 3)

    Mechanical Drawings Figure B-7. CEK Spring (Sheet 3 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 65: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 1 Of 6)

    Mechanical Drawings Figure B-8. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 66: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 2 Of 6)

    Mechanical Drawings Figure B-9. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 67: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 3 Of 6)

    Mechanical Drawings Figure B-10. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 68: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 4 Of 6)

    Mechanical Drawings Figure B-11. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 69: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 5 Of 6)

    Mechanical Drawings Figure B-12. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 70: Baseboard Keepout Footprint Definition And Height Restrictions For Enabling Components (Sheet 6 Of 6)

    Mechanical Drawings Figure B-13. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 71: B-14 1U Cek Heatsink (Sheet 1 Of 4)

    Mechanical Drawings Figure B-14. 1U CEK Heatsink (Sheet 1 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 72: B-15 1U Cek Heatsink (Sheet 2 Of 4)

    Mechanical Drawings Figure B-15. 1U CEK Heatsink (Sheet 2 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 73: B-16 1U Cek Heatsink (Sheet 3 Of 4)

    Mechanical Drawings Figure B-16. 1U CEK Heatsink (Sheet 3 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 74: B-17 1U Cek Heatsink (Sheet 4 Of 4)

    Mechanical Drawings Figure B-17. 1U CEK Heatsink (Sheet 4 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 75: Active Cek Thermal Solution Volumetric (Sheet 1 Of 3)

    Mechanical Drawings Figure B-18. Active CEK Thermal Solution Volumetric (Sheet 1 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 76: Active Cek Thermal Solution Volumetric (Sheet 2 Of 3)

    Mechanical Drawings Figure B-19. Active CEK Thermal Solution Volumetric (Sheet 2 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 77: Active Cek Thermal Solution Volumetric (Sheet 3 Of 3)

    Mechanical Drawings Figure B-20. Active CEK Thermal Solution Volumetric (Sheet 3 of 3) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 78: B-21 1U Alternative Heatsink (1 Of 4)

    Mechanical Drawings Figure B-21. 1U Alternative Heatsink (1 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 79: B-22 1U Alternative Heatsink (2 Of 4)

    Mechanical Drawings Figure B-22. 1U Alternative Heatsink (2 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 80: B-23 1U Alternative Heatsink (3 Of 4)

    Mechanical Drawings Figure B-23. 1U Alternative Heatsink (3 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 81: B-24 1U Alternative Heatsink (4 Of 4)

    Mechanical Drawings Figure B-24. 1U Alternative Heatsink (4 of 4) Quad-Core Intel® Xeon® Processor 5400 Series TMDG...
  • Page 82 Mechanical Drawings § Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 83: C.1 Overview

    The measurement load offset depends on the whole assembly stiffness (i.e. motherboard, clip, fastener, etc.). For example, the Quad-Core Intel® Xeon® Processor 5400 Series CEK Reference Heatsink Design clip and fasteners assembly have a stiffness of around 160 N/mm [915 lb/in]. If the resulting protrusion is 0.038 mm [0.0015”], then a extra load of 6.08 N [1.37 lb] will be created, and will...

  • Page 84: Load Cell Installation In Machined Heatsink Base Pocket - Bottom View

    Heatsink Base Heatsink Base Pocket Pocket Diameter ~ Diameter ~ 29 mm 29 mm [~1.15”] [~1.15”] Heatsink Clip Load Methodology Package IHS Package IHS Outline (Top Outline (Top Surface) Surface) Load Load Cells Cells Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 85: Load Cell Installation In Machined Heatsink Base Pocket - Side View

    Figure C-3. Preload Test Configuration Quad-Core Intel® Xeon® Processor 5400 Series TMDG Wax to maintain load cell in Wax to maintain load cell in position during heatsink position during heatsink installation installation...

  • Page 86: Typical Test Equipment

    2. Install the test vehicle in the socket. 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Quad-Core Intel® Xeon® Processor 5400 Series CEK-reference heatsink example in Figure 4.

  • Page 87: Preload Degradation Under Bake Conditions

    Sample rate = 0.01 Hz for the remainder of the bake test 5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz. Quad-Core Intel® Xeon® Processor 5400 Series TMDG §...
  • Page 88 Heatsink Clip Load Methodology Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 89: Safety Requirements

    UL94V-2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges. Quad-Core Intel® Xeon® Processor 5400 Series TMDG §...
  • Page 90 Safety Requirements Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 91: Quality And Reliability Requirements

    Environmental Reliability Testing E.1.2.1 Structural Reliability Testing The Intel reference heatsinks will be tested in an assembled condition, along with the LGA771 Socket. Details of the Environmental Requirements, and associated stress tests, can be found in the LGA771 Socket Mechanical Design Guide.

  • Page 92: Use Conditions Environment

    (slope up) • 20 Hz to 500 Hz @ 0.01 /Hz (flat) • Random control limit tolerance is ± 3 dB Quad-Core Intel® Xeon® Processor 5400 Series TMDG Quality and Reliability Requirements Example 10- Example 7-Yr Yr Stress Stress Equiv.

  • Page 93: Recommended Bios/Processor/Memory Test Procedures

    • All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test.
  • Page 94 Quality and Reliability Requirements Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

  • Page 95: F.1 Supplier Information

    F.1.1 Intel Enabled Suppliers The Intel reference enabling solution for Quad-Core Intel® Xeon® Processor 5400 Series is preliminary. The Intel reference solutions have not been verified to meet the criteria outlined in solution components from the suppliers listed in For additional details, please refer to the Quad-Core Intel® Xeon® Processor 5400 Series thermal mechanical enabling components drawings in Table F-1.

  • Page 96: F.1.2 Additional Suppliers

    Material CEK Spring for CEK771 Note: CEK771-02-1U is the 1U alternative reference heatsink design for Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form factors. F.1.2 Additional Suppliers The Intel enabled solutions for Quad-Core Intel® Xeon® Processor 5400 Series are preliminary.

  • Page 97: Additional Suppliers For The Quad-Core Intel® Xeon® Processor 5400 Series

    Enabled Suppliers Information Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2) Assembly Component 2U Heatsink Alternative CEK Heatsink Quad-Core Intel® Xeon® Processor 5400 Series TMDG Development Description Suppliers Copper Fin,...
  • Page 98 Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 2 of 2) Assembly Component 1U Heatsink Alternative CEK Heatsink Development Description Suppliers Copper Fin, Aavid Copper Base Thermalloy CNDA#2525071 Copper Fin, ADDA Copper Base...
  • Page 99 Enabled Suppliers Information § Quad-Core Intel® Xeon® Processor 5400 Series TMDG...
  • Page 100 Enabled Suppliers Information Quad-Core Intel® Xeon® Processor 5400 Series TMDG...

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X5472 - cpu xeon quad core 3.00ghz fsb1600mhz 12m lga771 trayXeon 5400 series

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