Loading Specifications; Board Deflection Guidance; Socket And Ilm Mechanical Specifications - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications
5.4

Loading Specifications

The socket will be tested against the conditions listed in the LGA1366 Socket Validation
Reports with heatsink and the ILM attached, under the loading conditions outlined in
this chapter.
Table 5-3
The maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The socket body should not be used as a mechanical reference or
load-bearing surface for thermal solutions.
Table 5-3.

Socket and ILM Mechanical Specifications

Static compressive load from ILM cover to
processor IHS
Heatsink static compressive load
Total static compressive load
(ILM plus Heatsink)
Dynamic compressive load (with heatsink
installed)
Pick & place cover insertion / removal force
Load lever actuation force
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. This is the minimum and maximum static force that can be applied by the heatsink and it's retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits.
3. Loading limits are for the LGA1366 socket.
4. This minimum limit defines the compressive force required to electrically seat the processor onto the socket
contacts.
5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6. Test condition used a heatsink mass of 550gm [1.21 lb] with 50 g acceleration measured at heatsink mass.
The dynamic portion of this specification in the product application can have flexibility in specific values, but
the ultimate product of mass times acceleration should not exceed this dynamic load.
5.4.1

Board Deflection Guidance

See Intel
Revision 2.1 for detailed board deflection guidance.
August 2010
Order Number: 323107-002US
provides load specifications for the LGA1366 socket with the ILM installed.
Parameter
® ®
Xeon Processor 5500 Series Thermal/Mechanical Design Guide (TMDG),
Min
445 N [100 lbf]
0 N [0 lbf]]
470 N (106 lbf)
N/A
N/A
N/A
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Max Notes
623 N [140 lbf] 3, 4
266 N [60 lbf] 1, 2, 3
890 N (200 lbf) 3, 4
890 N [200 lbf] 1, 3, 5, 6
10.2 N [2.3 lbf]
38.3 N [8.6 lbf] in the
vertical direction.
10.2 N [2.3 lbf] in the
lateral direction.
Thermal/Mechanical Design Guide
33