7.5.3
Power Thermal Utility
The Intel
and thermal testing of the processor.
The Utility will allow power and thermal testing of the processor. The thermal solution
must be designed to keep the processor Tcase within specification for the Thermal
Design Power (TDP) as specified in
obtain the latest revision of the PTU.
The default power level from the drop down list represents TDP.
7.6
Thermal Features
More information regarding processor thermal features is contained in the appropriate
Datasheet.
7.6.1
Fan Speed Control
There are many ways to implement fan speed control. Using processor ambient
temperature (in addition to Digital Thermal Sensor) to scale fan speed with ambient
temperature can improve acoustics when DTS > TCONTROL.
Table 7-2.
Fan Speed Control, T
Condition
DTS ≤ T
CONTROL
DTS > T
CONTROL
7.6.1.1
T
CONTROL
Factory configured T
Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the
appropriate Electrical, Mechanical, and Thermal Specifications (EMTS) for more
information.
®
®
Intel
Xeon
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
61
®
®
Xeon
processor C5500/C3500 series Power Thermal Utility allows power
CONTROL
FSC can adjust fan speed to maintain DTS ≤ T
FSC should adjust fan speed to keep T
specification (increased acoustic region).
Guidance
values are available in the appropriate Dear Customer
CONTROL
Section
6. Contact your Intel representative to
and DTS Relationship
FSC Scheme
CASE
Thermal Solutions
(low acoustic region).
CONTROL
at or below the Thermal Profile
August 2010
Order Number: 323107-002US